Electronic device including display with bent area

ABSTRACT

A portable electronic device is provided. The electronic device includes a transparent front glass cover including a planar portion that forms a front surface of the electronic device, a planar rear glass cover that forms a rear surface of the electronic device, a metal bezel that surrounds a space formed by the front glass cover and the rear glass cover, and a flexible display device that is embedded in the space and exposed through the front glass cover. The front cover includes a left bent portion and a right bent portion on the left and right of the planar portion at the center of the front cover.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit under 35 U.S.C. §119(e) of a U.S.provisional patent application filed on Feb. 6, 2015 in the UnitedStates Patent and Trademark Office and assigned Ser. No. 62/113,108, andunder 35 U.S.C. §119(a) of a Korean patent application filed on May 7,2015 in the Korean Intellectual Property Office and assigned Serialnumber 10-2015-0063939, the entire disclosure of each of which is herebyincorporated by reference.

TECHNICAL FIELD

The present disclosure relates to an electronic device. Moreparticularly, the present disclosure relates to an electronic devicethat includes a display with a bent or curved area.

BACKGROUND

With the advancement of electronic communication technologies,electronic devices having various functions have appeared. Suchelectronic devices generally have a convergence function that performsone or more function compositely.

As the functional differences between electronic devices of respectivemanufacturers have recently been greatly reduced, the manufacturers tendto make an effort to increase the rigidity of the electronic devices,which are being gradually slimmed in order to satisfy consumers'purchasing needs, and to strengthen the design features of theelectronic devices. As a part of the effort, various structures (e.g.,exteriors) of the electronic devices are at least partially implementedby using a metal material so as to appeal to the luxuriousness andelegance of the exterior of electronic devices.

In addition, terminal manufacturers make an effort to deliver intuitiveand diverse information to users through slimmed electronic devices, andas a part of the effort, the terminal manufacturers tend to releasedisplays of various shapes to display information.

Further, the manufacturers make an effort to address, for example, aweakened rigidity issue, a ground issue (e.g., an electric shock issue),and the issue of reduced antenna radiating performance, which areencountered when a metal material is used.

Electronic devices of the related art have adopted standardized planardisplays as an information output means. Such displays promoteinformation delivery merely by enlarging a screen thereof. As such, itis unavoidable that the entire volume of the electronic devices increaseby the enlarged area of the display. In addition, since the standardizedplanar displays allow information to be confirmed in only one directionaccording to the disposed condition of the electronic devices, theinformation delivery capability is inevitably limited.

Therefore, a need exists for an electronic device that includes adisplay with a bent or curved area.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

SUMMARY

Aspects of the present disclosure are to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below. Accordingly, an aspect of the presentdisclosure is to provide an electronic device including a display with abent area.

Another aspect of the present disclosure is to provide an electronicdevice including a display with a bent area, which is configured toenable information delivery in various directions.

Another aspect of the present disclosure is to provide an electronicdevice including a display with a bent area, which is capable ofimproving the convenience of use by intuitively providing diverseinformation to users.

In accordance with an aspect of the present disclosure, an electronicdevice is provided. The electronic device includes a transparent frontglass cover that includes a planar surface that forms a front surface ofthe electronic device, a planar rear glass cover that forms a rearsurface of the electronic device, a metal bezel that surrounds a spaceformed by the front glass cover and the rear glass cover, and a flexibledisplay device that is embedded in the space and exposed through thefront glass cover.

The front glass cover includes a first curved surface that extends froma first side edge of the planar surface, and a second curved surfacethat extends from a second side edge of the planar surface and is formedopposite to the first curved surface. The flexible display deviceincludes a touch screen that extends along the first curved surface, theplanar surface, and the second curved surface.

The metal bezel includes a first side surface that encloses an edge ofthe first curved surface, a second side surface that encloses an edge ofthe second curved surface, a third side surface that interconnects oneend of the first side surface and one end of the second side surface,and a fourth side surface that interconnects the other end of the firstside surface and the other end of the second side surface.

The first side surface and the second side surface have a first height,and the third side surface and the fourth side surface have a secondheight that is larger than the first height.

In accordance with another aspect of the present disclosure, anelectronic device is provided. The electronic device includes atransparent front glass cover that includes a first planar surface thatforms a front surface of the electronic device, a planar rear glasscover that includes a second planar surface that forms a rear surface ofthe electronic device, a metal bezel that surrounds a space formed bythe front glass cover and the rear glass cover, and a flexible displaydevice that is embedded in the space and exposed through the front glasscover.

The front glass cover includes a first curved surface that extends froma first side edge of the first planar surface, and a second curvedsurface that extends from a second side edge of the first planar surfaceand is formed opposite to the first curved surface.

The rear glass cover includes a third curved surface that extends from afirst side edge of the second planar surface, and a fourth curvedsurface that extends from a second side edge of the second planarsurface and is formed opposite to the third curved surface.

The flexible display device includes a touch screen that extends alongthe first curved surface, the first planar surface, and the secondcurved surface.

The metal bezel includes a first side surface that encloses edges of thefirst curved surface and the third curved surface, a second side surfacethat encloses edges of the second curved surface and the fourth curvedsurface, a third side surface that interconnects one end of the firstside surface and one end of the second side surface, and a fourth sidesurface that interconnects the other end of the first side surface andthe other end of the second side surface.

The first side surface and the second side surface have a first heightand the third side surface and the fourth side surface have a secondheight that is larger than the first height.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a block diagram of a configuration of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 2A is a front perspective view of an electronic device according tovarious embodiments of the present disclosure;

FIG. 2B is a rear perspective view of an electronic device according tovarious embodiments of the present disclosure;

FIG. 2C illustrates views obtained by viewing an electronic deviceaccording to various embodiments of the present disclosure in variousdirections;

FIG. 3 is a perspective view illustrating an electronic device in adisassembled state according to various embodiments of the presentdisclosure;

FIG. 4A is a cross-sectional view illustrating an electronic device inan assembled state according to various embodiments of the presentdisclosure;

FIG. 4B is a cross-sectional view of a principal portion according tovarious embodiments of the present disclosure;

FIG. 4C is a cross-sectional view of a principal portion illustrating anelectronic device in the assembled state, which includes opaque layers,according to various embodiments of the present disclosure;

FIGS. 5A to 5C are views illustrating a front window in the assembledstate according to various embodiments of the present disclosure;

FIG. 6 is a view illustrating a manufacturing process of a housingaccording to various embodiments of the present disclosure;

FIG. 7A is a configuration view illustrating a housing by a dualinjection molding according to various embodiments of the presentdisclosure;

FIG. 7B is a perspective view of a principal portion is illustratedwhere a housing and a bracket are coupled to each other according tovarious embodiments of the present disclosure;

FIG. 7C is a perspective view of a principal portion in which a portionof a bracket is illustrated which is coupled to a housing couplingportion in FIG. 7B according to various embodiments of the presentdisclosure;

FIG. 8A is an exploded perspective view illustrating a state in which awireless power transmission/reception member is applied to an electronicdevice according to various embodiments of the present disclosure;

FIG. 8B is a view illustrating a housing to which a wireless powertransmission/reception member is applied according to variousembodiments of the present disclosure;

FIG. 8C is a cross-sectional view illustrating a principal portion in astate where a wireless power transmission/reception member iselectrically connected to a printed circuit board (PCB) according tovarious embodiments of the present disclosure;

FIG. 8D is a configuration view illustrating a wireless powertransmission/reception member according to various embodiments of thepresent disclosure;

FIGS. 9A and 9B are views illustrating a use state of an electronicdevice according to various embodiments of the present disclosure;

FIGS. 10A and 10B are views illustrating various shapes of front windowsapplied to an electronic device according to various embodiments of thepresent disclosure;

FIG. 11A is a front side perspective view of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 11B is a rear side perspective view of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 11C illustrates views obtained by viewing an electronic device invarious directions according to various embodiments of the presentdisclosure;

FIG. 12A is a configuration view illustrating a battery pack accordingto various embodiments of the present disclosure;

FIG. 12B is a configuration view illustrating a state in which a batterypack is applied to a housing of an electronic device according tovarious embodiments of the present disclosure;

FIG. 12C is a configuration view illustrating a state in which a batterypack is applied to a housing and a PCB of an electronic device accordingto various embodiments of the present disclosure;

FIG. 13 is a cross-sectional view illustrating a principal portion of anelectronic device in a state where a battery pack and a PCB areoverlapped with each other according to various embodiments of thepresent disclosure;

FIGS. 14A and 14B are views illustrating a principal portion of anelectronic device, in which methods of mounting electronic componentsusing a thickness of a battery pack are illustrated according to variousembodiments of the present disclosure;

FIG. 15 is a view illustrating a disposed relationship between a PCMunit of a battery pack and electronic components according to variousembodiments of the present disclosure;

FIG. 16 is a configuration view illustrating a disposed relationshipbetween a power control module (PCM) unit of a battery pack and anelectronic component according to various embodiments of the presentdisclosure;

FIGS. 17A and 17B are configuration views illustrating a disposedrelationship between a PCM unit of a battery pack and a PCB of anelectronic device according to various embodiments of the presentdisclosure;

FIGS. 18A and 18B are configuration views of a key button according tovarious embodiments of the present disclosure;

FIG. 19 is a perspective view illustrating a flexible PCB (FPCB)assembly in a disassembled state according to various embodiments of thepresent disclosure;

FIGS. 20A to 20E are views illustrating a process of installing a keybutton and an FPCB assembly to a housing of an electronic deviceaccording to various embodiments of the present disclosure;

FIGS. 21A to 21D are configuration views illustrating a principalportion in a state where an FPCB assembly is installed in the housing ofthe electronic device according to various embodiments of the presentdisclosure;

FIG. 22 is an exploded perspective view of an FPCB assembly according tovarious embodiments of the present disclosure;

FIGS. 23A to 23E are views illustrating a process of installing keybuttons and an FPCB assembly to a housing of an electronic deviceaccording to various embodiments of the present disclosure;

FIGS. 24A to 24D are configuration views illustrating a principalportion in a state where an FPCB assembly is installed to a housing ofan electronic device according to various embodiments of the presentdisclosure;

FIGS. 25A and 25C are configuration views illustrating a principalportion in a state where key buttons and an FPCB assembly are installedaccording to various embodiments of the present disclosure;

FIGS. 26A and 26B are configuration views of a key button according tovarious embodiments of the present disclosure;

FIGS. 27A to 27D are views illustrating a process of installing a keybutton and an FPCB assembly to a housing of an electronic deviceaccording to various embodiments of the present disclosure;

FIGS. 28A to 28D are configuration views illustrating a configuration ofa home key button of an electronic device according to variousembodiments of the present disclosure;

FIGS. 29A and 29B are configuration views illustrating an installationand operation relationships of a home key button of an electronic deviceaccording to various embodiments of the present disclosure;

FIG. 30 is a view illustrating a fixing relationship of an FPCB that isprovided on a home key button according to various embodiments of thepresent disclosure;

FIGS. 31A and 31B are configuration views of a home key button of anelectronic device according to various embodiments of the presentdisclosure;

FIGS. 32A to 32C are configuration views illustrating a home key buttoninstalled to a wearable electronic device according to variousembodiments of the present disclosure;

FIG. 33 is a configuration view illustrating a metal member and anon-metal member that are applied to a housing of an electronic deviceaccording to various embodiments of the present disclosure;

FIGS. 34A and 34B are views illustrating a process of manufacturing ahousing of an electronic device according to various embodiments of thepresent disclosure;

FIGS. 35A and 35B are views illustrating a configuration of a metalfiller according to insert-molding of a non-metal member according tovarious embodiments of the present disclosure;

FIGS. 36A and 36B are views illustrating a state in which a metal filleris used as an electric connection member of an antenna device accordingto various embodiments of the present disclosure;

FIG. 37 is a configuration view illustrating a principal portion in astate where a non-metal member is insert-molded to a metal memberaccording to various embodiments of the present disclosure;

FIGS. 38A to 38C are configuration views illustrating a state in which anon-metal member is insert-molded to a metal member according to variousembodiments of the present disclosure;

FIGS. 39A and 39B are configuration views illustrating a state in which,when a non-metal member is insert-molded to a metal member, a part ofthe non-metal member is used as an insulation member according tovarious embodiments of the present disclosure; and

FIG. 40 illustrates a block diagram of a configuration of an electronicdevice according to various embodiments of the present disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In addition, descriptions of well-known functionsand constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of the presentdisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of the presentdisclosure is provided for illustration purpose only and not for thepurpose of limiting the present disclosure as defined by the appendedclaims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to those ofskill in the art, may occur in amounts that do not preclude the effectthe characteristic was intended to provide.

The terms “have”, “may have”, “include”, or “may include” as used hereinindicate the presence of disclosed corresponding functions, operations,elements, and the like, and do not limit additional one or morefunctions, operations, elements, and the like. In addition, the terms“include” or “have” indicate the presence of features, numbers,operations, elements, parts, or a combination thereof described in thespecifications, and do not preclude the presence or addition of one ormore other features, numbers, operations, elements, parts, or acombination thereof.

The terms “A or B”, “at least one of A or/and B” or “one or more of Aor/and B” as used herein include any and all combinations of wordsenumerated with it. For example, “A or B”, “at least one of A and B” or“at least one of A or B” describes (1) including A, (2) including B, or(3) including both A and B.

Although terms, such as “first” and “second” as used herein may modifyvarious elements of various embodiments of the present disclosure, theseterms do not limit the corresponding elements. For example, these termsdo not limit an order and/or importance of the corresponding elements.These terms may be used for the purpose of distinguishing one elementfrom another element. For example, a first user device and a second userdevice both indicate user devices and may indicate different userdevices. For example, a first element may be named a second elementwithout departing from the scope of the present disclosure, andsimilarly, a second element may be named a first element.

When an element (e.g., a first element) is “connected to” or“(operatively or communicatively) coupled with/to” another element(e.g., a second element), the first element may be directly connected orcoupled to the second element, and there may be an intervening element(e.g., a third element) between the first element and the secondelement. To the contrary, when an element (e.g., the first element) is“directly connected” or “directly coupled” to another element (e.g., thesecond element), there is no intervening element (e.g., the thirdelement) between the first element and the second element.

The expression “configured to (or set to)” as used herein may bereplaced with “suitable for”, “having the capacity to”, “designed to”,“adapted to”, “made to”, or “capable of” according to the situation. Theterm “configured to (set to)” does not necessarily indicate“specifically designed to” in a hardware level. Instead, the expression“apparatus configured to . . . ” may indicate that the apparatus is“capable of . . . ” along with other devices or parts in a certainsituation. For example, “a processor configured to (set to) perform A,B, and C” may be a dedicated processor, e.g., an embedded processor, forperforming a corresponding operation, or a generic-purpose processor,e.g., a central processing unit (CPU) or an application processor (AP),capable of performing a corresponding operation by executing one or moresoftware programs stored in a memory device.

The terms as used herein are used merely to describe certain embodimentsof the present disclosure and are not intended to limit the presentdisclosure. Further, all the terms used herein, including technical andscientific terms, should be interpreted to have the same meanings ascommonly understood by those skilled in the art to which the presentdisclosure pertains, and should not be interpreted to have ideal orexcessively formal meanings, unless explicitly defined herein.

A module or programming module, according to various embodiments of thepresent disclosure, may further include at least one or more constituentelements among the aforementioned constituent elements, or may omit someof them, or may further include additional constituent elements.Operations performed by a module, programming module, or otherconstituent elements may be executed in a sequential, parallel,repetitive, or heuristic manner. In addition, some of the operations maybe executed in a different order or may be omitted, or other operationsmay be added.

An electronic device, according to various embodiments of the presentdisclosure, may include at least one of a smart phone, a tablet personalcomputer (PC), a mobile phone, a video phone, an e-book reader, adesktop PC, a laptop PC, a netbook computer, a workstation, a server, apersonal digital assistant (PDA), a portable multimedia player (PMP), amoving picture experts group phase 1 or phase 2 (MPEG-1 or MPEG-2) audiolayer 3 (MP3) player, a mobile medical device, a camera, or a wearabledevice (e.g., a head-mounted-device (HMD), an electronic glasses, anelectronic clothing, an electronic bracelet, an electronic necklace, anelectronic appcessory, an electronic tattoo, a smart mirror, a smartwatch, and the like).

An electronic device may also be a smart home appliance. For example,smart home appliances may include at least one of a television (TV), adigital versatile disc (DVD) player, an audio component, a refrigerator,an air conditioner, a vacuum cleaner, an oven, a microwave oven, awashing machine, an air cleaner, a set-top box, a home automationcontrol panel, a security control panel, a TV box (e.g., SamsungHomeSync®, Apple TV®, or Google TV), a game console (e.g., Xbox®PlayStation®), an electronic dictionary, an electronic key, a camcorder,an electronic frame, and the like.

An electronic device may also include at least one of a medicalequipment (e.g., a mobile medical device (e.g., a blood glucosemonitoring device, a heart rate monitor, a blood pressure monitoringdevice, a temperature meter, and the like), a magnetic resonanceangiography (MRA) machine, a magnetic resonance imaging (MRI) machine, acomputed tomography (CT) scanner, an ultrasound machine, and the like),a navigation device, a global positioning system (GPS) receiver, anevent data recorder (EDR), a flight data recorder (FDR), an in-vehicleinfotainment device, an electronic equipment for a ship (e.g., a shipnavigation equipment and/or a gyrocompass), an avionics equipment, asecurity equipment, a head unit for vehicle, an industrial or homerobot, an automatic teller machine (ATM), point of sale (POS) device, oran internet of things device (e.g., a light bulb, various sensors, anelectronic meter, a gas meter, a sprinkler, a fire alarm, a thermostat,a streetlamp, a toaster, a sporting equipment, a hot-water tank, aheater, a boiler, and the like).

An electronic device may also include at least one of a piece offurniture or a building/structure, an electronic board, an electronicsignature receiving device, a projector, and various measuringinstruments (e.g., a water meter, an electricity meter, a gas meter, awave meter, and the like).

An electronic device may also include a combination of one or more ofthe above-mentioned devices.

Further, it will be apparent to those skilled in the art that anelectronic device is not limited to the above-mentioned examples.

Herein, the term “user” may indicate a person who uses an electronicdevice or a device (e.g., an artificial intelligence electronic device)that uses the electronic device.

An electronic device of a single radio environment can provide long-termevolution (LTE) service using circuit switched fall back (CSFB) whichdetermines whether paging information of a CS service network isreceived over an LTE network. When receiving a paging signal of the CSservice network over the LTE network, the electronic device connects (oraccesses) the CS service network (e.g., a 2^(nd) generation (2G)/3rdgeneration (3G) network) and provides a voice call service. For example,the 2G network can include one or more of a global system for mobilecommunications (GSM) network and a code division multiple access (CDMA)network. The 3G network can include one or more of a wideband-CDMA(WCDMA) network, a time division-synchronous CDMA (TD-SCDMA) network,and an evolution-data optimized (EV-DO) network.

Alternatively, the electronic device of the single radio environment canprovide LTE service using single radio LTE (SRLTE) which determineswhether the paging information is received by periodically switchingevery radio resource (e.g., receive antennas) to the CS service network(e.g., the 2G/3G network). Upon receiving the paging signal of the CSservice network, the electronic device provides the voice call serviceby connecting the CS service network (e.g., the 2G/3G network).

Alternatively, the electronic device of the single radio environment canprovide LTE service using single radio dual system (SRDS) whichdetermines whether the paging information is received by periodicallyswitching some of radio resources (e.g., receive antennas) to the CSservice network (e.g., the 2G/3G network). Upon receiving the pagingsignal of the CS service network, the electronic device provides thevoice call service by connecting the CS service network (e.g., the 2G/3Gnetwork).

FIG. 1 is a block diagram of a configuration of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIG. 1, an electronic device 100 includes a bus 110, aprocessor 120, a memory 130, an input/output interface 150, a display160, and a communication interface 170. In various embodiments of thepresent disclosure, the electronic device 100 can omit at least one ofthe components or further include another component.

The bus 110 includes a circuit for connecting the components (e.g., theprocessor 120, the memory 130, the input/output interface 150, thedisplay 160, and the communication interface 170) and deliveringcommunications (e.g., a control message) therebetween.

The processor 120 includes one or more of a CPU, an AP, and acommunication processor (CP). The processor 120 processes an operationor data on control of and/or communication with another component of theelectronic device 100.

The processor 120, which is connected to the LTE network, determineswhether a call is connected over the CS service network using calleridentification information (e.g., a caller phone number) of the CSservice network (e.g., the 2G/3G network). For example, the processor120 receives incoming call information (e.g., a CS notification messageor a paging request message) of the CS service network over the LTEnetwork (e.g., CSFB). For example, the processor 120 being connected tothe LTE network receives incoming call information (e.g., a pagingrequest message) over the CS service network (e.g., SRLTE).

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 obtains caller identification informationfrom the incoming call information. The processor 120 displays thecaller identification information on its display 160. The processor 120determines whether to connect the call based on input informationcorresponding to the caller identification information displayed on thedisplay 160. For example, when detecting input information correspondingto an incoming call rejection, through the input/output interface 150,the processor 120 restricts the voice call connection and maintains theLTE network connection. For example, when detecting input informationcorresponding to an incoming call acceptance, through the input/outputinterface 150, the processor 120 connects the voice call by connectingto the CS service network.

When receiving the incoming call information (e.g., a CS notificationmessage or a paging request message) of the CS service network over theLTE network, the processor 120 obtains caller identification informationfrom the incoming call information. The processor 120 determines whetherto connect the call by comparing the caller identification informationwith a reception control list. For example, when the calleridentification information is included in a first reception control list(e.g., a blacklist), the processor 120 restricts the voice callconnection and maintains the connection to the LTE network. For example,when the caller identification information is not included in the firstreception control list (e.g., the blacklist), the processor 120 connectsthe voice call by connecting to the CS service network. For example,when the caller identification information is included in a secondreception control list (e.g., a white list), the processor 120 connectsthe voice call by connecting to the CS service network.

When receiving the incoming call information (e.g., a paging requestmessage) of the CS service network over the LTE network, the processor120 transmits an incoming call response message (e.g., a paging responsemessage) to the CS service network. The processor 120 suspends the LTEservice and receives the caller identification information (e.g., a CScall (CC) setup message) from the CS service network. The processor 120determines whether to connect the call by comparing the calleridentification information with the reception control list. For example,when the caller identification information is included in the firstreception control list (e.g., the blacklist), the processor 120restricts the voice call connection and resumes the LTE networkconnection. For example, when the caller identification information isnot included in the first reception control list (e.g., the blacklist),the processor 120 connects the voice call by connecting to the CSservice network. For example, when the caller identification informationis included in the second reception control list (e.g., the white list),the processor 120 connects the voice call by connecting to the CSservice network.

The memory 130 can include volatile and/or nonvolatile memory. Thememory 130 stores commands or data (e.g., the reception control list)relating to at least another component of the electronic device 100. Thememory 130 may store software and/or a program 140. The program 140 mayinclude, for example, a kernel 141, middleware 143, an applicationprogramming interface (API) 145, and/or application programs (or“applications”) 147. At least some of the kernel 141, the middleware143, and the API 145 may be referred to as an operating system (OS).

The kernel 141 controls or manages system resources (e.g., the bus 110,the processor 120, or the memory 130) used for performing an operationor function implemented by the other programs (e.g., the middleware 143,the API 145, or the applications 147). Furthermore, the kernel 141provides an interface through which the middleware 143, the API 145, orthe applications 147 connects the individual elements of the electronicdevice 100 to control or manage the system resources.

The middleware 143 functions as an intermediary for allowing the API 145or the applications 147 to communicate with the kernel 141 to exchangedata.

In addition, the middleware 143 processes one or more task requestsreceived from the applications 147 according to priorities thereof. Forexample, the middleware 143 assigns priorities for using the systemresources (e.g., the bus 110, the processor 120, the memory 130, and thelike) of the electronic device 100, to at least one of the applications147. For example, the middleware 143 may perform scheduling or loadbalancing on the one or more task requests by processing the one or moretask requests according to the priorities assigned thereto.

The API 145 is an interface through which the applications 147 controlfunctions provided from the kernel 141 or the middleware 143, and mayinclude at least one interface or function (e.g., an instruction) forfile control, window control, image processing, text control, and thelike.

The input/output interface 150 functions as an interface that transfersinstructions or data input from a user or another external device to theother element(s) of the electronic device 100. Furthermore, theinput/output interface 150 outputs the instructions or data receivedfrom the other element(s) of the electronic device 100 to the user or anexternal electronic device.

The display 160 may include a liquid crystal display (LCD), a lightemitting diode (LED) display, an organic LED (OLED) display, a microelectro mechanical system (MEMS) display, an electronic paper display,and the like. The display 160 displays various types of content (e.g., atext, images, videos, icons, symbols, and the like) for the user. Thedisplay 160 may include a touch screen and receive, for example, atouch, a gesture, proximity, a hovering input, and the like, using anelectronic pen or the user's body part. The display 160 may display aweb page.

The communication interface 170 can establish a communication betweenthe electronic device 100 and an external electronic device (e.g., afirst external electronic device 102, a second external electronicdevice 104, or a server 106). For example, the communication interface170 can communicate with the first external electronic device 102through a wireless communication or a wired communication 164, and alsocommunicate with the second external electronic device 104, or theserver 106 in connection to a network 162 through wireless communicationor wired communication. For example, the wireless communication canconform to a cellular communication protocol including at least one ofLTE, LTE-advanced (LTE-A), CDMA, WCDMA, universal mobiletelecommunications system (UMTS), wireless broadband (WiBro), and GSM.

The wired communication can include at least one of universal serial bus(USB), high definition multimedia interface (HDMI), recommended standard232 (RS-232), and plain old telephone service (POTS).

The network 162 can include at least one of telecommunications networks,for example, a computer network (e.g., a local area network (LAN) or awide area network (WAN)), the Internet, a telephone network, and thelike.

The electronic device 100 provides the LTE service in the single radioenvironment by use of at least one module functionally or physicallyseparated from the processor 120. Various embodiments of the presentdisclosure will be described with reference to a display that includes abent or curved area and is applied to a housing of an electronic device,in which a non-metal member and a metal member (e.g., a metal bezel) areformed through dual injection molding, but are not limited thereto. Forexample, the display may be applied to a housing, in which a metalmember or a non-metal member is formed of a single material.

Each of the first external electronic device 102 and the second externalelectronic device 104 may be a type of device that is the same as ordifferent from the electronic device 101. According to an embodiment ofthe present disclosure, the server 106 may include a group of one ormore servers. According to various embodiments of the presentdisclosure, all or some of the operations to be executed by theelectronic device 101 may be executed by another electronic device or aplurality of other electronic devices (e.g., the first externalelectronic device 102 and the second external electronic device 104 orthe server 106). According to an embodiment of the present disclosure,in the case where the electronic device 101 should perform a certainfunction or service automatically or by request, the electronic device101 may request some functions that are associated therewith from theother electronic devices (e.g., the first external electronic device 102and the second external electronic device 104 or the server 106) insteadof or in addition to executing the function or service by itself. Theother electronic devices (e.g., the first external electronic device 102and the second external electronic device 104 or the server 106) mayexecute the requested functions or additional functions, and maytransmit the results to the electronic device 101. The electronic device101 may provide the requested functions or services by processing thereceived results as they are or additionally. For this purpose, forexample, a cloud computing technique, a distributed computing technique,or a client-server computing technique may be used.

Various embodiments of the present disclosure will be described withreference to a display that includes a bent or curved area and isapplied to a housing of an electronic device, in which a non-metalmember and a metal member (e.g., a metal bezel) are formed through dualinjection molding, but are not limited thereto. For example, the displaymay be applied to a housing, in which a metal member or a non-metalmember is formed of a single material.

FIG. 2A is a front perspective view of an electronic device according tovarious embodiments of the present disclosure. FIG. 2B is a rearperspective view of an electronic device according to variousembodiments of the present disclosure. FIG. 2C illustrates viewsobtained by viewing an electronic device according to variousembodiments of the present disclosure.

Referring to FIGS. 2A to 2C, a display 201 may be installed on a frontsurface 2001 of an electronic device 200. A receiver 202 for receiving avoice of a counterpart may be disposed at the upper side of the display201. A microphone device 203 for transmitting a voice of a user of theelectronic device to the counterpart may be disposed at the lower sideof the display 201.

According to an embodiment of the present disclosure, components forperforming various functions of the electronic device 200 may bedisposed around the receiver 202. The components may include at leastone sensor module 204. The sensor module 204 may include at least oneof, for example, an illuminance sensor (e.g., an optical sensor), aproximity sensor (e.g., an optical sensor), an infrared sensor, anultrasonic sensor, and the like. According to an embodiment of thepresent disclosure, the components may include a front camera device205. According to an embodiment of the present disclosure, thecomponents may include an indicator 206 to inform the user of stateinformation of the electronic device 200.

According to various embodiments of the present disclosure, theelectronic device 200 may include a metal bezel 220 as a metal housing.According to an embodiment of the present disclosure, the metal bezel220 may be disposed along the outer periphery of the electronic device200 and may be disposed to extend to at least a part of the rear surfaceof the electronic device 200, which is continuous to the outerperiphery. According to an embodiment of the present disclosure, themetal bezel 220 defines at least a part of the thickness of theelectronic device 200 along the outer periphery of the electronic device200, and may be formed in a closed loop shape. Without being limitedthereto, however, the metal bezel 220 may be formed in a manner thatcontributes to at least a part of the thickness of the electronic device200. According to an embodiment of the present disclosure, the metalbezel 220 may only be disposed in a part or more of the outer peripheryof the electronic device 200. According to an embodiment of the presentdisclosure, when the metal bezel 220 may contribute to a part of thehousing of the electronic device 200, the remaining portion of thehousing may be replaced by a non-metal material. In such a case, thehousing may be formed in a manner of insert-molding the non-metal memberto the metal bezel 220. According to an embodiment of the presentdisclosure, the metal bezel 220 may include one or more cut-off portions225 and 226 so that a unit bezel portion separated by the cut-offportions 225 and 226 may be utilized as an antenna radiator. Accordingto an embodiment of the present disclosure, an upper bezel portion 223may be configured as a unit bezel portion by one pair of cut-offportions 225 that are formed at a certain interval. According to anembodiment of the present disclosure, a lower bezel portion 224 may beconfigured as a unit bezel portion by one pair of cut-off portions 226that are formed at a certain interval. According to an embodiment of thepresent disclosure, the cut-off portions 225 and 226 may be formed inunison when the non-metal member is insert-molded to the metal member.

According to various embodiments of the present disclosure, the metalbezel 220 may have a closed loop shape along the outer periphery and maybe disposed in a manner of contributing to the entire thickness of theelectronic device 200. According to an embodiment of the presentdisclosure, when the electronic device 200 is viewed from the front sidethereof, the metal bezel 220 may include a left bezel portion 221, aright bezel portion 222, an upper bezel portion 223, and a lower bezelportion 224.

According to various embodiments of the present disclosure, on the lowerbezel portion 224 of the electronic device, various electroniccomponents may be disposed. According to an embodiment of the presentdisclosure, a speaker device 208 may be disposed at one side of themicrophone device 203. According to an embodiment of the presentdisclosure, at the other side of the microphone device 203, an interfaceconnector port 207 may be disposed to perform a datatransmission/reception function with respect to an external device andto charge the electronic device 200 by receiving an external powerapplied thereto. According to an embodiment of the present disclosure,at one side of the interface connector port 207, an ear jack hole 209may be disposed. According to an embodiment of the present disclosure,all the microphone device 203, the speaker device 208, the interfaceconnector port 207, and the ear jack hole 209 as described above may bedisposed within the area of the unit bezel portion that is formed by onepair of cut-of portions 226 disposed in the lower bezel portion 224.Without being limited thereto, however, at least one of theabove-described electronic components may be disposed in the area thatincludes the cut-off portion 226, or may be disposed outside the unitbezel portion.

According to various embodiments of the present disclosure, variouselectronic components may also be disposed on the upper bezel portion223 of the electronic device 200. According to an embodiment of thepresent disclosure, on the upper bezel portion 223, a socket device 216for insertion of a card-type external device may be disposed. Accordingto an embodiment of the present disclosure, the socket device 216 mayaccommodate at least one of an inherent identification (ID) card for theelectronic device (e.g., a subscriber identity module (SIM) card or auser identity module (UIM)), and a memory card for extending a storagespace. According to an embodiment of the present disclosure, at one sideof the socket device 216, an infrared sensor module 218 may be disposed,and at one side of the infrared sensor module 218, an auxiliarymicrophone device 217 may be disposed. According to an embodiment of thepresent disclosure, all the socket device 216, the infrared sensormodule 218, and the auxiliary microphone device 217 may be disposedwithin the area of the unit bezel portion formed by one pair of cut-offportions 225 that are disposed in the upper bezel portion 223. Withoutbeing limited thereto, however, at least one of the above-mentionedelectronic components may be disposed in the area that includes of thecut-off portion 225, or may disposed outside the cut-off portion.

According to various embodiments of the present disclosure, one or morefirst side key buttons 211 may be disposed on the left bezel portion 221of the metal bezel 220. According to an embodiment of the presentdisclosure, one pair of first side key buttons 211 may be disposed onthe left bezel portion 221 to partially protrude to contribute to theexecution of a volume up/down function, a scroll function, and the like.According to an embodiment of the present disclosure, one or more sidekey buttons 212 may be disposed on the right bezel portion 222 of themetal bezel 220. According to an embodiment of the present disclosure,the second side key button 212 may be configured to perform a powerON/OFF function, an electronic device wake-up/sleep function, and thelike. According to an embodiment of the present disclosure, at least onekey button 210 may be disposed in at least a portion of the lower area,except for the display on the front surface 2001 of the electronicdevice 200. According to an embodiment of the present disclosure, thekey button 210 may perform a home key button function. According to anembodiment of the present disclosure, a fingerprint recognition sensordevice may be disposed on the top surface of the home key button.According to an embodiment of the present disclosure, the home keybutton may be configured to perform a first function (a home screenreturn function, a wake-up/sleep function, and the like) by physicallypressing the home key button, and to perform a second function (e.g., afingerprint recognition function) by swiping the top surface of the homekey button. Although not illustrated, touch pads may be disposed on theleft and right of the key button 210 so as to perform a touch function.

According to various embodiments of the present disclosure, a rearcamera device 213 may be disposed on the rear surface 2002 of theelectronic device 200, and one or more electronic components 214 may bedisposed at a side of the rear camera device 213. According to anembodiment of the present disclosure, the electronic components 214 mayinclude at least one of an illuminance sensor (e.g., an optical sensor),a proximity sensor (e.g., an optical sensor), an infrared sensor, anultrasonic sensor, a heartrate sensor, a flash device, and the like.

According to various embodiments of the present disclosure, the frontsurface 2001, in which the display 201 is provided, may include a planarportion 2011, and a left bent portion 2012 and a right bent portion 2013which are formed on the left and right of the planar portion 2011,respectively. According to an embodiment of the present disclosure, thefront surface 2001 of the electronic device 200 may include a displayarea 201 and the other areas (e.g., a black matrix (BM) area) by using asingle window. According to an embodiment of the present disclosure, theleft and right bent portions 2012 and 2013 may be formed to extend in anx-axis direction of the electronic device 200 of FIG. 2A from the planarportion 2011. According to an embodiment of the present disclosure, eachof the left and right bent portions 2012 and 2013 may be configured as apart of the side surfaces of the electronic device 200. In such a case,the left and right bent portions 2012 and 2013 may be configured as theside surfaces of the electronic device 200 together with the left andright bezel portions 221 and 222 of the metal bezel 220, respectively.Without being limited thereto, however, the front surface 2001, in whichthe display 201 is provided, may include at least one of the left andright bent portions 2012 and 2013. According to an embodiment of thepresent disclosure, the front surface 2001 may be configured to includeonly the left bent portion 2012 along the planar portion 2011, or toinclude only the right bent portion 2013 along the planar portion 2011.

According to various embodiments of the present disclosure, the frontsurface 2001 may include a flexible display module that is applied to atleast a portion of the window that includes the bent portions 2012 and2013 on the left and right thereof, and the lower side of the window.According to an embodiment of the present disclosure, the area includingthe flexible display module may be configured as a display area 201.According to an embodiment of the present disclosure, the window may beformed in a manner in which the top and rear surfaces thereof aresimultaneously bent (hereinafter, a “three-dimensional (3D) type”).Without being limited thereto, the window may be formed in a manner inwhich the left and right portions of the top surface are formed in acurved shape and the rear surface is formed in a planar shape(hereinafter, “two-and-a-half dimensional (2.5D) type”). According to anembodiment of the present disclosure, the window may be formed of atransparent glass material (e.g., a sapphire glass) or a transparentsynthetic resin material.

According to various embodiments of the present disclosure, theelectronic device 200 may control the display module so as toselectively display information. According to an embodiment of thepresent disclosure, the electronic device 200 may control the displaymodule so as to configure a screen only on the planar portion 2011.According to an embodiment of the present disclosure, the electronicdevice 200 may control the display module to configure a screen by anyone of the left and right bent portions 2012 and 2013 together with theplanar portion 2011. According to an embodiment of the presentdisclosure, the electronic device 200 may control the display module toconfigure a screen by at least one of the left and right bent portions2012 and 2013, excluding the planar portion 2011.

According to various embodiments of the present disclosure, the rearsurface 2002 of the electronic device 200 may also be entirely formed byone window 215. According to an embodiment of the present disclosure,the rear surface 2002 may include a planar portion 2151 that issubstantially formed in the central portion to be the center, and a leftbent portion 2152 and a right bent portion 2153, which are formed on theleft and right of the planar portion 2151, respectively. According to anembodiment of the present disclosure, the window 215 may be configuredin the 2.5D type in which the left and right bent portions 2152 and 2153of the outer surface are formed in a curved shape and the rear surfaceis formed as a planar surface. Without being limited thereto, however,the window 215 may be formed in the 3D type similar to the windowdisposed on the front surface 2001. According to an embodiment of thepresent disclosure, each of the left and right bent portions 2152 and2153 may be configured as a part of the side surfaces of the electronicdevice 200. In such a case, the left and right bent portion 2152 and2153 may be configured as the side surfaces of the electronic device 200together with the left and right bezel portions 221, 222 of the metalbezel 220. Without being limited thereto, however, the rear surface 2002may include only at least one of the left and right bent portions 2152and 2153. According to an embodiment of the present disclosure, the rearsurface 2002 may be configured to include only the left bent portion2152 along the planar portion 2151, or to include only the right bentportion 2153 along the planar portion 2151.

According to various embodiments of the present disclosure, the upperside left and right corner portions and the lower side left and rightcorner portions of the front surface 2001 may be formed to besimultaneously inclined in the x-axis direction, the y-axis direction,and the z-axis direction in FIG. 2A while the window is bent. With thisshape, the upper side left and right corner portions and the lower sideleft and right corner portions of the metal bezel 220 may be formed suchthat the heights thereof gradually decrease towards the side surfaces,respectively.

While a metal bezel, which is configured as a part of the housing of theelectronic device, has been illustrated and described above, variousembodiments of the present disclosure are not limited thereto. Forexample, various metal members disposed on the electronic device may beused for various embodiments of the present disclosure.

FIG. 3 is a perspective view of an electronic device according tovarious embodiments of the present disclosure in a disassembled state.Hereinafter, the electronic device illustrated in FIG. 3 may be anelectronic device which is the same as the above-described electronicdevice 200.

Referring to FIG. 3, an electronic device 300 may include a printedcircuit board (PCB) 360, a bracket 320, a display module 330, and afront window 340, which may be disposed in a manner of beingsequentially staked on the upper side of the housing 310. According toan embodiment of the present disclosure, the electronic device mayinclude a wireless power transmission/reception member 380 and a rearwindow 350, which may be disposed in a manner of being sequentiallystaked on the lower side of the housing 310. According to an embodimentof the present disclosure, the battery pack 370 is accommodated in anaccommodation space 311 of the battery pack 370, which is formed in thehousing 310, and may be disposed to avoid the PCB 360. According to anembodiment of the present disclosure, the battery pack 370 and the PCB360 may be disposed in parallel not to overlap with each other.According to an embodiment of the present disclosure, the display module330 may be fixed to the bracket 320, and the front window 340 may befixed by being attached to the bracket 320 by a first adhesive member391. According to an embodiment of the present disclosure, the rearwindow 350 may be fixed by being attached to the housing 310 by a secondadhesive member 392.

According to various embodiments of the present disclosure, the frontwindow 340 may include a planar portion 3401, and a left bent portion3402 and a right bent portion 3403, which are bent in oppositedirections from the planar portion 3401. According to an embodiment ofthe present disclosure, the front window 340 is positioned on theelectronic device 300 so as to form the front surface, and is formed ofa transparent material so as to display a screen presented by thedisplay module 330 and to provide an input/output window for varioussensors. According to an embodiment of the present disclosure, while ashape in which the left and right bent portions 3402 and 3403 are formedin the 3D type is illustrated, a shape in which the upper and lowerportions as well as the left and right portions are single-bent, or ashape in which the upper, lower, left, and right portions are dual-bent,may be applied. According to an embodiment of the present disclosure, atouch panel may be further disposed on the rear surface of the frontwindow 340 and may receive a touch input signal from the outside.

According to various embodiments of the present disclosure, the displaymodule 330 may also be formed in a shape corresponding to that of thefront window 340 (a shape having a curvature corresponding to that ofthe front window 340). According to an embodiment of the presentdisclosure, the display module 330 may include a planar portion 3301,and left and right bent portions 3302 and 3303 on the left and right ofthe planar portion 3301. According to an embodiment of the presentdisclosure, a flexible display module may be used as the display module330. According to an embodiment of the present disclosure, in the caseof a window in a type where the rear surface of the front window 340 isformed in a planar shape (hereinafter, 2D type or 2.5 D type), since therear surface of the front window 340 is planar, an ordinary LCD or anon-cell touch screen panel (TSP) active matrix OLED (AMOLED) (OCTA) maybe applied.

According to various embodiments of the present disclosure, the firstadhesive member 391 is a component for fixing the front window 340 to abracket 320 that is disposed within the electronic device 300, and maybe a kind of tape, such as a double-sided tape, or a liquid adhesivelayer, such as a bond. According to an embodiment of the presentdisclosure, when the double-sided tape is applied as the first adhesivemember 391, a general polyethylene terephthalate (PET) or a functionalbase may be applied as the internal base of the adhesive member 391. Forexample, by using a base formed of a foam type or shock-resistive fabricmaterial so as to reinforce the shock resistance, it is possible toprevent the front window from being destroyed by external impact.

According to various embodiments of the present disclosure, the bracket320 may be used as a component for reinforcing the entire rigidity ofthe electronic device 300 by being disposed within the electronic device300. According to an embodiment of the present disclosure, the bracket320 may be formed of at least one metal selected from aluminum (Al),magnesium (Mg), and STS. According to an embodiment of the presentdisclosure, the bracket 320 may be formed of a highly rigid plastic, inwhich glass fibers are contained, or may be formed of a combination of ametal and a plastic. According to an embodiment of the presentdisclosure, when a metal member and a non-metal member are used incombination, the bracket 320 may be formed by insert-molding thenon-metal member to the metal member. According to an embodiment of thepresent disclosure, the bracket 320 is placed on the rear surface of thedisplay module 330. The bracket 320 may have a shape (curvature) that issimilar to the shape of the rear surface of the display module 330 andmay support the display module 330. According to an embodiment of thepresent disclosure, between the bracket 320 and the display module 330,an elastic member, such as a sponge or a rubber and an adhesive layer,such as a double-sided tape or a kind of sheet, such as a single-sidedtape, may be additionally disposed so as to protect the display module330. According to an embodiment of the present disclosure, a section ofthe bracket 320 may further include a slot-sinking or hole area 321 forsecuring a component mounting space or a marginal space based on achange of a component during use, such as the swelling of the batterypack 370. According to an embodiment of the present disclosure, asneeded, a sheet-type meal or composite material may be added to thecorresponding hole area 321 so as to reinforce the internal rigidity, oran auxiliary device for improving a thermal characteristic, an antennacharacteristic, and the like, may be further provided in the hole area321. According to an embodiment of the present disclosure, the bracket320 may be fastened to the housing (e.g., the rear case) 310 so as toform a space therein, and at least one electronic component may bedisposed in such a space. The at least one electronic component mayinclude a PCB 360. Without being limited thereto, however, the at leastone electronic component may include an antenna device, a sound device,a power supply device, a sensor device, and the like in addition to thePCB 360.

According to various embodiments of the present disclosure, the batterypack 370 may supply power to the electronic device 300. According to anembodiment of the present disclosure, one surface of the battery pack370 may be close to the display module 330 and the other surface may beclose to the rear window 350 so that when the battery pack 370 swellsduring charge, counterpart objects may be deformed or destroyed. Inorder to prevent this, a space (swelling gap) may be provided betweenthe battery pack 370 and the counterpart objects (e.g., the displaymodule 330 and the rear window 350) so as to protect the counterpartobjects. According to an embodiment of the present disclosure, thebattery pack 370 may be disposed in a form of being integrated with theelectronic device 300. Without being limited thereto, however, when therear window 350 is implemented to be attachable to/detachable from theelectronic device 300, the battery pack 370 may be implemented to beattachable/detachable.

According to various embodiments of the present disclosure, the housing310 forms the exterior of the electronic device 300 (e.g., side surfacesincluding a metal bezel), and may be coupled to the bracket 320 so as toform an internal space. According to an embodiment of the presentdisclosure, a front window 340 may be disposed on the front surface ofthe housing 310, and a rear window 350 may be disposed on the rearsurface of the housing 310. Without being limited thereto, however, therear surface of the housing 310 may be variously implemented by moldinga synthetic resin, or by using a metal, a composite of a metal and asynthetic resin, and the like. According to an embodiment of the presentdisclosure, an inter-structure gap formed by the housing 310 and therear window 350 may prevent the destruction of the rear window 350 fromthe secondary impact by an internal structure when an external impactoccurs, such as the drop of the electronic device 300.

According to various embodiments of the present disclosure, a wirelesspower transmission/reception member 380 may be disposed on the rearsurface of the housing 310. According to an embodiment of the presentdisclosure, the wireless power transmission/reception member 380 mainlyhas a thin film form and is disposed by being attached to one surface ofan internally mounted component or an area of the inner surface of thehousing 310, in particular to an area that is generally close to therear window 350. The wireless power transmission/reception member 380includes a structure that forms a contact with the PCB 360 within thehousing 310. According to an embodiment of the present disclosure, thewireless power transmission/reception member 380 may be embedded orattached as a component of the battery pack 370, and the like, or a partof the housing 310, and may be provided in the form of being attached toboth of a component and the housing 310.

According to various embodiments of the present disclosure, the secondadhesive member 392 is a component that fixes the rear window 350 to thehousing 310 and may be applied in a form similar to that of the firstadhesive member 391 described above.

According to various embodiments of the present disclosure, the rearwindow 350 may be applied in a form similar to that of the front window340. According to an embodiment of the present disclosure, the frontsurface (the surface exposed to the outside) of the rear window 350 maybe formed in a curvature that is more inclined as going to both of theleft and right ends. According to an embodiment of the presentdisclosure, the rear surface of the rear window 350 may be formed in aplanar surface to be attached to the hosing 310 by the second adhesivemember 392.

FIG. 4A is a cross-sectional view illustrating an electronic device inthe assembled state according to various embodiments of the presentdisclosure. FIG. 4B is a cross-sectional view of a principal portion ofFIG. 4A according to various embodiments of the present disclosure.

Referring to FIGS. 4A and 4B, the bracket 320 may be fixed to thehousing 310. According to an embodiment of the present disclosure, thehousing 310 may be formed by injection-molding a non-metal member (e.g.,polycarbonate (PC)) 313 to the metal bezel 312. According to anembodiment of the present disclosure, the display module 330 may befixed to the front surface of the bracket 320, and the front window 340may be disposed on the display module 330. According to an embodiment ofthe present disclosure, the front window 340 may be fixed by beingattached to the bracket 320 by the first adhesive member 391 adjacent toan end of the housing 310. According to an embodiment of the presentdisclosure, the front window 340 may be fixed by being attached to thebracket 320 by the first adhesive member 391 to correspond to the shapethereof on the end of the housing 310. According to an embodiment of thepresent disclosure, the front window 340 may be fixed by being attachedto the bracket 320 by the first adhesive member 391 while beingsupported by the end of the housing 310. According to an embodiment ofthe present disclosure, the front window 340 may have a uniformthickness and may be formed in a shape having a certain curvature.According to an embodiment of the present disclosure, all of the planarportion and the left and right bent portions of the front window 340 maybe formed to have a certain thickness.

According to various embodiments of the present disclosure, the rearwindow 350 may also be fixed to the housing 310 by the second adhesivemember 392. According to an embodiment of the present disclosure, therear window 350 may be formed to have a thickness that is reducedtowards the left and right edges (a shape which is formed in the 2.5Dtype).

According to various embodiments of the present disclosure, in the spacebetween the bracket 320 and the housing 310, an electronic component,such as the PCB 360, may be accommodated, and the battery pack 370 maybe disposed in parallel with the PCB 360 to avoid the PCB 360.

FIG. 4C is a cross-sectional view of a principal portion illustrating anelectronic device, which includes opaque layers, in an assembled stateaccording to various embodiments of the present disclosure.

Referring to FIG. 4C, according to an embodiment of the presentdisclosure, opaque layers 393 and 394 may be disposed between the rearsurface of the front window 340 and the display module 330 and betweenthe housing 310 and the rear surface of the rear window 350,respectively, so as to conceal the interior of the electronic device300. According to an embodiment of the present disclosure, the opaquelayer 394 disposed on the front window 340 may be applied to the area(e.g., the BM area), excluding the display area. According to anembodiment of the present disclosure, the opaque layers 393 and 394 maybe implemented through a process, such as printing, vapor deposition, orpainting, or a subsidiary material, such as a film-type sheet may beadditionally attached thereto. According to an embodiment of the presentdisclosure, the sheet may include various forms of patterns on onesurface thereof, which are formed through various processes, such asultraviolet (UV) molding, printing, and painting. According to anembodiment of the present disclosure, the sheet may be applied not onlyto the rear window 350, but also to the front window 340. According toan embodiment of the present disclosure, the light transmittance of thewindow itself may be lowered by coloring the window glass itself, or theaesthetics may be enhanced by applying various colors thereto. Accordingto an embodiment of the present disclosure, on the rear surface of therear window 350, one or more electronic components may be furtherdisposed. According to an embodiment of the present disclosure, theelectronic components may include an input device, such as a touchpanel, and a charge device, such as a wireless charge module, acommunication module, such as a near field communication (NFC) antenna,or a display module may be additionally disposed.

FIGS. 5A to 5C are views illustrating a front window in the assembledstate according to various embodiments of the present disclosure.

Referring to FIGS. 5A to 5C, each of the front window 340 and the rearwindow 350 has an outer edge portion, and a single housing 310 may beimplemented to enclose the edge portions of the front and rear windows340 and 350. The housing 310 may include a front opening portion 314 anda rear opening portion 315, and the front window 340 and the rear window350 may be seated on the front and rear opening portions 314 and 315,respectively. The front window 340 may have a shape that is implementedby bending a flat glass while applying heat/pressure thereto, and on across-sectional view, the tip end of the edge portion of the frontwindow 340 may be implemented in the form of being orthogonal to thesurface of the window. The surface of the housing 310, which is close tothe tip end of the edge portion of the front window 340, may beimplemented in a shape that is parallel with the edge portion.

According to an embodiment of the present disclosure, the tip end of theedge portion of the front window 340 may be fabricated in various shapesthrough processing, and corresponding to this, the housing 310 may havean assembly portion having a shape corresponding to the shape of the tipend. For example, as illustrated in FIG. 5B, the tip end face may beprocessed to have a wedge shape 341 in cross-section, of which the sidesare parallel to the X-axis and the Y-axis, respectively, rather than aslope shape, and the shape of a seat portion 3121 of the housing may beimplemented to correspond to the processed wedge shape 341. In anotherexample, as illustrated in FIG. 5C, the tip end face may be processed tohave a wedge shape in cross-section, of which the sides are parallel tothe X-axis and the Y-axis, respectively, rather than a slope shape and aseparate interface member 396 may be added between the window 340 andthe housing 310. According to an embodiment of the present disclosure,the interface member 396 may be first attached to the window 340 so asto be easily assembled to the housing 310. The interface member 396 maybe in the form of enclosing the edge portion of the window 340 so as toprotect the edge portion of the window 340 against external impact.According to an embodiment of the present disclosure, the interfacemember 396 may be disposed along the outer periphery of the electronicdevice 300 such that a part of the interface member 396 may be exposedso as to improve the aesthetic feeling of the electronic device 300.According to an embodiment of the present disclosure, the interfacemember 396 may be formed of a plastic material, such as PC or PC-glassfiber (GF). Alternatively, the interface member 396 may be formed of anelastic material, such as rubber or urethane.

FIG. 6 is a view illustrating a manufacturing process of a housingaccording to various embodiments of the present disclosure.

Referring to FIG. 6, a housing 604 may be manufactured through a processas follows. In the first operation, a metal 601, such as Al or Mg, isprovided, and a portion to be filled by injection molding the housingand principal shapes may be processed. The processing may be performedthrough not only a computer numerical control (CNC), but also any otherprocessing apparatus or method. In the second operation, a processedinsert portion may be inserted into a mold so as to progress injectionmolding 602. Areas required for injection molding in the housing 604,such as a portion for antenna radiation and a portion for preventingelectric shock, may be manufactured through the insert molding. In thethird operation, it is possible to further process a shape additionallywith a product which has been completely insert-molded 603. In such anoperation, the metal and a molded product may be simultaneouslyprocessed, and only one of the metal and the molded product may beprocessed. In such an operation, the processing of operations in thecorner portions of the housing (see FIGS. 7A to 7C) may progress. In thefourth operation, the above-described operations are completed and thusa complete product (a housing that includes a metal member and anon-metal member which are dually injection-molded) may be provided.

FIG. 7A is a configuration view illustrating a housing by a dualinjection molding according to various embodiments of the presentdisclosure. FIG. 7B is a perspective view of a principal portion inwhich a portion is illustrated where a housing and a bracket are coupledto each other according to various embodiments of the presentdisclosure. FIG. 7C is a perspective view of a principal portion inwhich a portion of a bracket is illustrated which is coupled to ahousing coupling portion in FIG. 7B according to various embodiments ofthe present disclosure.

Referring to FIGS. 7A to 7C, a housing 700, in which a non-metal member720 is insert-molded to a metal member 710, may be provided. Accordingto an embodiment of the present disclosure, the edge portions of thehousing 700 (the portions illustrated by dotted lines in the four cornerportions in FIG. 7A) may be formed in a shape corresponding to the edgeportions of the front window. More particularly, each of the cornerportions may be implemented in a curved shape, which is changed in thedirections of all the three axes of the X, Y, and Z-axes. According toan embodiment of the present disclosure, when the housing 700 ismanufactured by injection molding, the shapes of the corner portions andthe inner portions of the corner portions may be easily manufacturedaccording to the shapes of cavities of a manufactured mold. However,when the housing is manufactured using a metal, it is difficult toprocess the shape of each of the corner portions in the curved shape,which is changed in the directions of all the three axes of the X, Y,and Z-axes. More particularly, the inner portion of each of the cornerportions is a portion that is mated in shape with the bracket, and maycause an assembly issue due to a processing deviation, and the like whenit is processed as a 3-dimensionally curved surface.

Accordingly, when the inner portion of each corner of the housing 700 isformed in a single planar shape in order to facilitate assembly and toreduce a processing deviation, the processed area may be widened so thatthe processing time increases, and a deformation may be caused in theproduct according to the processing. Accordingly, by processing theinner portion of each corner portion stepwise such that the innerportion has a plurality of operation portions 701 to 704, it is possibleto reduce the processing deviation that occurs during the processing ofa 3-dimensionally curved surface, and to improve the long processingtime that is required to process an end surface, the deformation of theproduct, and the like. According to an embodiment of the presentdisclosure, a counterpart (e.g., the bracket 730) that is mated in shapewith the housing 700 may also be processed to have a plurality ofcorresponding operational portions 731 to 734. Through this, by makingthe corner portions of the housing and the corner portions of thebracket be strongly engaged with each other, it is possible to preventthe electronic device from being distorted, and by minimizing thedeformation of the electronic device when an external impact is appliedthereto, it is possible to prevent the front and rear windows, as wellas the display module of the electronic device, from being destroyed.

FIG. 8A is an exploded perspective view illustrating a state in which awireless power transmission/reception member is applied to an electronicdevice according to various embodiments of the present disclosure. FIG.8B is a view illustrating a housing to which a wireless powertransmission/reception member is applied according to variousembodiments of the present disclosure. FIG. 8C is a cross-sectional viewillustrating a principal portion in a state in which a wireless powertransmission/reception member is electrically connected to a PCBaccording to various embodiments of the present disclosure.

Referring to FIGS. 8A to 8C, a wireless power transmission/receptionmember 810 may be disposed such that the wireless powertransmission/reception member 810 faces the rear window over a portionof a housing 800 and a battery pack 830 (corresponding to the batterypack 370 of FIG. 3). According to an embodiment of the presentdisclosure, the wireless power transmission/reception member 810 may bea wireless charge module, or a communication module, such as anNFC/magnetic security transmission (MST) antenna.

According to various embodiments of the present disclosure, the housing800 may include an opening 801 for accommodating the battery pack 830,and one or more flanges 8011 and 8012 may be formed to protrude in thedirection of the opening 801 along the periphery of the opening 801.According to an embodiment of the present disclosure, the wireless powertransmission/reception member 810 may be disposed in a manner of beingattached to the flanges 8011 and 8012 and the surface of the batterypack 830.

According to various embodiments of the present disclosure, the wirelesspower transmission/reception member 810 may formed in the form of a thinfilm, and may include a plurality of coil-type antenna radiators.According to an embodiment of the present disclosure, the plurality ofantenna radiators may be wound in various manners (e.g., in a spiralmanner) according to the characteristic of a corresponding communicationmodule. According to an embodiment of the present disclosure, each ofthe plurality of coil-type antenna radiators may be disposed on the sameplane in one film to be parallel with each other.

According to various embodiments of the present disclosure, the wirelesspower transmission/reception member 810 may include a body portion 811to be disposed on the flanges 8011 and 8012 of the opening 801 and apart of the surface of the battery pack 830, a tail portion 812 drawnout from the body portion 811, and a contact portion 813 drawn from thebody portion 811. According to an embodiment of the present disclosure,the contact portion 813 may be disposed to correspond to a plurality ofcontact terminals 821 mounted on a PCB 820. According to an embodimentof the present disclosure, when the body portion 811 is disposed to beflush with the front surface of the housing 800 or above the frontsurface, the contact portion 813 may be disposed on the rear surface ofthe housing 800 so as to be in physical contact with the contactterminals 821 of the PCB 820 that is positioned below the contactportion 813.

According to various embodiments of the present disclosure, a pluralityof electronic components 802 and 803 may be mounted in the housing 800,and the tail portion 812 may be disposed to accommodate the electroniccomponents 802 and 803. According to an embodiment of the presentdisclosure, the tail portion 812 may include an inner space, and thewireless power transmission/reception member 811 may be disposed suchthat the electronic components 802 and 803 are disposed within the innerspace. According to an embodiment of the present disclosure, theelectronic components may include the above-described rear camera 802,various sensor modules, and a flash device 803.

FIG. 8D is a configuration view illustrating a wireless powertransmission/reception member 840 according to various embodiments ofthe present disclosure.

Referring to FIG. 8D, the wireless power transmission/reception member840 may include the body portion 841 applied to an opening of thehousing, the tail portion 842 drawn out from the body portion 841 tohave a certain inner space, and the contact portion 843 drawn from thebody portion 841 to be in electrical and physical contact with contactterminals of the PCB.

According to various embodiments of the present disclosure, the wirelesspower transmission/reception member 840 may be formed in a film type,and may be disposed such that a plurality of coil-type antenna radiatorsare disposed on the same plane to be spaced apart from each other. Eachof the antenna radiators may be connected to the contact portion 843.According to an embodiment of the present disclosure, in the bodyportion 841, a coil-type wireless charge antenna radiator 845 for use inwireless power charge (WPC) may be wound in a spiral type around thecentral portion of the body portion 841. According to an embodiment ofthe present disclosure, in the body portion 841, a coil-type antennaradiator 846 for use in MST may be disposed to surround the coil-typewireless charge antenna radiator 845. According to an embodiment of thepresent disclosure, a coil-type antenna radiator 847 for use in NFC maybe disposed in a spiral type along the tail portion 842. According to anembodiment of the present disclosure, each of the coil-type antennaradiators 845, 846, 847 may be disposed on the same plane of a film tobe spaced apart from each other.

FIGS. 9A and 9B are views illustrating a use state of an electronicdevice according to various embodiments of the present disclosure.

Referring to FIGS. 9A and 9B, an electronic device 900, which includes adisplay having a curved area as described above, may not be equippedwith physical key buttons on the side surfaces thereof as the left andright curvatures of the front and rear windows increase. In such a case,a structure, which is capable of implementing side key button functionsin the left and right bent portions of the display area that occupiesthe side spaces of the electronic device 900, may be required. In such acase, in an “A” area in FIG. 9A, a corresponding function may beperformed by an operation as illustrated in FIG. 9B, in addition to atouch function corresponding to a side key button function. Such afunction may include a volume up/down function, a wake-up/sleepfunction, a power ON/OFF function, a power supply/cut-off function, andthe like.

According to various embodiments of the present disclosure, such afinger touch recognition method enables recognition by a capacitivetouch method similar to the display, and may be implemented byseparately mounting a pressure sensor on the rear surface of the windowin an additional method. According to an embodiment of the presentdisclosure, in order to allow the user to know a finger touch and avolume control, operation-related feedback transfer to the user may beperformed using a vibration motor or a sound device.

FIGS. 10A and 10B are views illustrating various shapes of front windowsapplied to an electronic device according to various embodiments of thepresent disclosure.

Referring to FIGS. 10A and 10B, each of front windows 1010 and 1020 ispositioned on the front side of an electronic device so as to form thefront surface. Each of the windows 1010 and 1020 may be formed of atransparent material so as to display a screen that is presented by adisplay module, and may provide an input/output window of various sensormodules.

Referring to FIG. 10A, the front window 1010 may include bent portionsthat are formed by bending an upper area 1012 and a lower area 1013 withreference to a display area 1011. In such a case, a display modulecorresponding to the front window 1010 may also be formed in thecorresponding shape.

Referring to FIG. 10B, the front window 1020 may include bent portionsformed by bending a left area 1022, a right area 1023, an upper area1024, and a lower area 1025 with reference to the display area 1021. Inaddition, in such a case, a display module corresponding to the frontwindow may be disposed in the corresponding shape.

According to various embodiments of the present disclosure, each of theabove-described front windows 1010 and 1020 may be formed as a 3D type,in which the thickness from the display area to the bent areas isuniform, or may be formed in a 2.5D type, in which the front surface ofeach of the front windows 1010 and 1020 has a curvature, and the rearsurface has a planar shape.

FIG. 11A is a front side perspective view of an electronic deviceaccording to various embodiments of the present disclosure. FIG. 11B isa rear side perspective view of an electronic device according tovarious embodiments of the present disclosure. FIG. 11C illustratesviews obtained by viewing an electronic device in various directionsaccording to various embodiments of the present disclosure.

The configuration illustrated in FIGS. 11A to 11C is generally similarto the configuration illustrated in FIGS. 2A to 2C, except for theconfiguration of the front window and the rear window. Accordingly,descriptions of overlapping technical contents will be omitted.

Referring to FIGS. 11A to 11C, according to various embodiments of thepresent disclosure, an electronic device 1100 may include a frontsurface 1101 that may be formed by a transparent window. According to anembodiment of the present disclosure, the front surface 1101 may includea display area 1110. According to an embodiment of the presentdisclosure, the front surface 1101 may include a planar portion 1111,and a left bent portion 1112 and a right bent portion 1113, which areformed by bending left and right areas with reference to the planarportion 1111, respectively.

According to various embodiments of the present disclosure, theelectronic device 1100 may include a rear surface 1102, which may alsobe formed by a transparent window. According to an embodiment of thepresent disclosure, the rear surface 1102 may include a planar portion1121, and a left bent portion 1122 and a right bent portion 1123, whichare formed by bending left and right areas with reference to the planarportion 1121, respectively.

According to various embodiments of the present disclosure, the left andright bent portions 1112 and 1113 of the front surface 1101, and theleft and right bent portions 1122 and 1123 of the rear surface 1102 maybe formed such that the bent sizes thereof are equal to each other.Without being limited thereto, however, the left and right bent portions1112 and 1113 of the front surface 1101 and the left and right bentportions 1122 and 1123 of the rear surface 1102 may be formed such thatat least one of them has a different size. According to an embodiment ofthe present disclosure, the windows of the front surface 1101 and therear surface 1102 may be formed in the above-described 3D type or 2.5Dtype.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes atransparent front glass cover that includes a planar surface that formsa front surface of the electronic device, a planar rear glass cover thatforms a rear surface of the electronic device, a metal bezel thatsurrounds a space formed by the front glass cover and the rear glasscover, and a flexible display device that is embedded in the space andexposed through the front glass cover.

The front glass cover includes a first curved surface that extends froma first side edge of the planar surface, and a second curved surfacethat extends from a second side edge of the planar surface and is formedopposite to the first curved surface. The flexible display deviceincludes a touch screen that extends along the first curved surface, theplanar surface, and the second curved surface.

The metal bezel includes a first side surface that encloses an edge ofthe first curved surface, a second side surface that encloses an edge ofthe second curved surface, a third side surface that interconnects oneend of the first side surface and one end of the second side surface,and a fourth side surface that interconnects the other end of the firstside surface and the other end of the second side surface.

The first side surface and the second side surface have a first height,and the third side surface and the fourth side surface have a secondheight that is larger than the first height.

According to various embodiments of the present disclosure, in a cornerwhere the first side surface and the third side surface areinterconnected and in a corner where the first side surface and thefourth side surface are interconnected, the height of the first sidesurface may gradually increase from the first height to the secondheight.

According to various embodiments of the present disclosure, in a cornerwhere the second side surface and the third side surface areinterconnected and in a corner where the second side surface and thefourth side surface are interconnected, the height of the second sidesurface may gradually increase from the first height to the secondheight.

According to various embodiments of the present disclosure, the portableelectronic device may further include a communication receiver speakerthat penetrates an opening that is formed through the front glass cover.

According to various embodiments of the present disclosure, the portableelectronic device may further include a processor and a memory withinthe space. The memory may store instructions that, upon being executed,cause the processor to display a first screen on a first area of thetouch screen, which is positioned on the planar surface, a secondscreen, which is differentiated from the first screen, on a second areaof the touch screen, which is positioned on the first curved surface,and a third screen, which is differentiated from the first screen, on athird area of the touch screen, which is positioned on the second curvedsurface.

According to various embodiments of the present disclosure, the flexibledisplay device may include a single flexible OLED display that extendsalong the first curved surface, the planar surface, and the secondcurved surface.

According to various embodiments of the present disclosure, the portableelectronic device may further include a first non-metal portion and asecond non-metal portion that are formed on the third side surfaceperpendicular to a longitudinal direction of the third side surface.

According to various embodiments of the present disclosure, the portableelectronic device may further include at least one of an opening on thethird side surface between the first non-metal portion and the secondnon-metal portion, a SIM tray that is removably inserted into theopening, and an infrared (IR) device that is exposed on the third sidesurface.

According to various embodiments of the present disclosure, the firstnon-metal portion may be positioned close to the first side surface andthe second non-metal surface may be positioned close to the second sidesurface, and the IR device may be positioned in a middle portion of thethird side surface between the first non-metal portion and the secondnon-metal portion.

According to various embodiments of the present disclosure, the portableelectronic device may further include an opening that is formed on thethird side surface between the first non-metal portion or the secondnon-metal portion and the IR device. The SIM tray may be removablyinserted into the opening.

According to various embodiments of the present disclosure, the portableelectronic device may further include a third non-metal portion and afourth non-metal portion that are formed on the fourth side surfaceperpendicular to a longitudinal direction of the fourth side surface.

According to various embodiments of the present disclosure, the portableelectronic device may further include at least one of an audio deviceinsertion hole, a connector opening, and a speaker hole on the fourthside surface between the third non-metal portion and the fourthnon-metal portion.

According to various embodiments of the present disclosure, the thirdnon-metal portion may be positioned close to the first side surface andthe fourth non-metal portion may be positioned close to the second sidesurface. The connector opening may be positioned in a middle portion ofthe third side surface between the third non-metal portion and thefourth non-metal portion.

According to various embodiments of the present disclosure, the audiodevice insertion hole may be positioned between the third non-metalportion and the connector opening, and the speaker hole is positionedbetween the fourth non-metal portion and the connector opening.

According to various embodiments of the present disclosure, the portableelectronic device may further include at least one of an NFC antenna, awireless charge coil, and a magnetic emulator antenna within the spaceclose to the rear glass cover.

According to various embodiments of the present disclosure the portableelectronic device may further include at least one opening and at leastone sound control key on the first side surface or the second sidesurface, the sound control key being configured to be pushed through theopening.

According to various embodiments of the present disclosure, the portableelectronic device may further include at least one opening and a powerkey on the second side surface or the first side surface, which isopposite to the first side surface or the second side surface thatincludes the sound control key, the power key being configured to bepushed through the opening.

According to various embodiments of the present disclosure, the portableelectronic device may further include a first touch area on a part ofthe first curved surface and/or a second touch area on a part of thesecond curved surface. The electronic device may be configured toreceive a volume control input through at least one of the first toucharea and the second touch area.

According to various embodiments of the present disclosure, the volumecontrol input may include a gesture input on a part of the first toucharea or the second touch area.

According to various embodiments of the present disclosure, the portableelectronic device may further include a first touch area on a part ofthe first curved surface and/or a second touch area on a part of thesecond curved surface. The electronic device may be configured toreceive a power ON or OFF input through at least one of the first toucharea and the second touch area.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes atransparent front glass cover that includes a first planar surface thatforms a front surface of the electronic device, a planar rear glasscover that includes a second planar surface that forms a rear surface ofthe electronic device, a metal bezel that surrounds a space formed bythe front glass cover and the rear glass cover, and a flexible displaydevice that is embedded in the space and exposed through the front glasscover.

The front glass cover includes a first curved surface that extends froma first side edge of the first planar surface, and a second curvedsurface that extends from a second side edge of the first planar surfaceand is formed opposite to the first curved surface.

The rear glass cover includes a third curved surface that extends from afirst side edge of the second planar surface, and a fourth curvedsurface that extends from a second side edge of the second planarsurface and is formed opposite to the third curved surface.

The flexible display device includes a touch screen that extends alongthe first curved surface, the first planar surface, and the secondcurved surface.

The metal bezel includes a first side surface that encloses edges of thefirst curved surface and the third curved surface, a second side surfacethat encloses edges of the second curved surface and the fourth curvedsurface, a third side surface that interconnects one end of the firstside surface and one end of the second side surface, and a fourth sidesurface that interconnects the other end of the first side surface andthe other end of the second side surface.

The first side surface and the second side surface have a first heightand the third side surface and the fourth side surface have a secondheight that is larger than the first height.

FIG. 12A is a configuration view illustrating a battery pack accordingto various embodiments of the present disclosure.

Referring to FIG. 12A, a battery pack 1200 includes a battery cell 1210,a power control module (PCM) unit 1230 disposed on a side area of theupper side of the battery cell 1210, and a connection terminal portion1231 that is drawn out from the PCM unit 1230 and electrically connectedto a PCB of an electronic device. According to an embodiment of thepresent disclosure, the PCM unit 1230 may be installed on a pouchterrace 1220 that is disposed on the upper portion of the battery cell1210. According to an embodiment of the present disclosure, the batterypack 1200 may be configured as a battery pack that is integrallyembedded in the electronic device.

According to various embodiments of the present disclosure, the PCM unit1230 may perform functions of detecting, when the voltage of the batterypack increases due to a charge voltage and a charge current that areinput from the outside, a battery voltage, and cutting off and releasingthe charge current such that the battery is not charged to a level thatis equal to or higher than an over-charge voltage set in a module.According to an embodiment of the present disclosure, the PCM unit 1230may perform a function of detecting, when the voltage of the battery isgradually discharged due to the current consumed to the outside, thebattery voltage, and cutting off and releasing the discharge currentsuch that the battery is not discharged to a level that is equal to orlower than an over-discharge voltage set in the module. According to anembodiment of the present disclosure, the PCM unit 1230 may perform afunction of cutting off and releasing a charge or discharge current suchthat the current is charged or discharged to a level that is equal to orhigher than an over-current set in the module due to an abnormalphenomenon of an electronic device or a charge device. According to anembodiment of the present disclosure, when plus (+) and minus (−)terminals are short-circuited in the outside of the battery pack, acurrent of about 20 times the capacity of the battery pack flowsinstantly. The PCM unit 1230 may perform functions of preventing anaccident and protecting the battery pack by cutting off the current.

While a battery pack is disposed in parallel with a PCB in an electronicdevice (for example, disposed in parallel with the exterior of thebattery pack), a restriction may be imposed in arranging electroniccomponents according to the mounting space of the battery pack by thePCM unit that is uniformly disposed on the upper portion of the batterypack. For example, due to the shape of the rectangular battery pack, thebattery pack may occupy a large space in the entire length direction ofthe PCM unit. Accordingly, it is necessary to make the arrangement ofthe PCM unit of the battery pack variable so as to maximize a spaceefficiency according to the mounting of the battery pack, therebycontributing to the slimming of the electronic device.

FIG. 12B is a configuration view illustrating a state in which batterypack is applied to a housing of an electronic device according tovarious embodiments of the present disclosure. FIG. 12C is aconfiguration view illustrating a state in which a battery pack isapplied to a housing and a PCB of an electronic device according tovarious embodiments of the present disclosure.

Referring to FIGS. 12B and 12C, the battery pack 1200 may be mounted inthe housing 1251 of the electronic device 1250. According to anembodiment of the present disclosure, the PCM unit 1230 of the batterypack 1200 is formed to be biased to one side in the entire lengthdirection, and an electronic component 1240 may be disposed in the areawhere the PCM unit 1230 is not disposed. According to an embodiment ofthe present disclosure, the PCM unit 1230 may be disposed at a positionwhere it is overlapped with the PCB 1260 of the electronic device 1250.According to an embodiment of the present disclosure, the PCM unit 1230may be disposed at a position where it is overlapped with the PCB 1260and to avoid the electronic component 1240 that is mounted on andprotrude from the PCB 1260. According to an embodiment of the presentdisclosure, the electronic component 1240 may include a component thatis mounded on and protrudes from the PCB 1260, such as a memory, aprocessor, various elements, a camera device, various sensor modules(e.g., a heart rate monitor (HRM) sensor module), a flash, and the like.

FIG. 13 is a cross-sectional view illustrating a principal portion of anelectronic device in a state where a battery pack and a PCB areoverlapped with each other according to various embodiments of thepresent disclosure.

Referring to FIG. 13, the electronic device 1250 may include the batterypack 1200 mounted therein. According to an embodiment of the presentdisclosure, the battery cell 1210 of the battery pack 1200 may bemounted in parallel with the PCB 1260 of the electronic device 1250 toavoid the PCB 1260. According to an embodiment of the presentdisclosure, the battery pack 1200 may be configured such that the PCMunit 1230 is drawn out by a certain length, and may be disposed suchthat at least a part of the PCM unit 1230 is overlapped with the PCB1260.

According to various embodiments of the present disclosure, the PCM unit1230 may be disposed on the bottom of the PCB 1260, and variouselectronic components 1240 and 1242 may be disposed on the top of thePCB 1260. According to an embodiment of the present disclosure, theelectronic component may be at least one of a memory, a processor,various elements, a camera device, various sensor modules, and a flashdevice. According to an embodiment of the present disclosure, bydisposing the PCM unit 1230 to overlap with the PCB 1260, in the bottomarea of the PCB 1260 that contributes to the thickness of the batterypack 1200, the window 1254 that includes the display 1253 and thebracket 1252 that supports the display 1253 may be at least partiallyaccommodated.

FIGS. 14A and 14B are views illustrating a principal portion of anelectronic device, in which methods of mounting electronic componentsusing a thickness of a battery pack are illustrated according to variousembodiments of the present disclosure.

Referring to FIGS. 14A and 14B, in the entire thickness w of the batterypack 1200, the remaining thicknesses w1 and w2, except the thickness ofthe PCM unit 1230, may be used as mounting spaces for various electroniccomponents 1240, 1242, and 1255, including the PCB 1260 of theelectronic device.

According to various embodiments of the present disclosure, in the upperarea of the PCM unit 1230, the PCB 1260 and electronic components 1240and 1243, such as a memory, a processor, various elements, a cameradevice, various sensor module, and a flash device, which are mounted onthe top of the PCB 1260, may be disposed. According to an embodiment ofthe present disclosure, in the entire thickness w of the battery pack1200, the upper thickness w1, except the thickness of the PCM unit 1230,may contribute to at least a part of a space, in which the PCB 1260 andelectronic components 1240 and 1242, such as a memory, a processor,various elements, a camera device, various sensor module, and a flashdevice, which are mounted on the top of the PCB 1260, may be applied.According to an embodiment of the present disclosure, in the thickness wof the battery pack 1200, the lower thickness w2, except the thicknessof the PCM unit 1230, may contribute to at least a part of a space, inwhich an electronic component for the display 1253 and the bracket 1252for supporting the display 1253 are applied.

FIG. 15 is a view illustrating a disposed relationship between a PCMunit of a battery pack and electronic components according to variousembodiments of the present disclosure.

Referring to FIG. 15, when a sensor module and a flash device 1542 arearranged below a camera module 1540 as the electronic components, thebattery cell 1510 of the battery pack 1500 may be disposed in parallelwith the PCB 1560 and the camera device 1540 mounted on the PCB 1560.According to an embodiment of the present disclosure, the PCM unit 1530of the battery pack 1500 may be disposed to overlap with the sensormodule and the flash device 1542 which are mounted on the PCB 1560.According to an embodiment of the present disclosure, the sensor moduleand the flash device 1542 may be mounted on the top of the PCB 1560, andthe PCM unit 1530 of the battery pack 1500 may be disposed on the bottomof the PCB 1560 to overlap with the sensor module and the flash device1542. Accordingly, as compared to an existing mounting structure inwhich the battery pack 1500 is disposed in parallel with the PCB 1560,it is possible to secure a component mounting space or to increase thecapacity of the battery cell 1510.

FIG. 16 is a configuration view illustrating a disposed relationshipbetween a PCM unit of a battery pack and an electronic componentaccording to various embodiments of the present disclosure.

Referring to FIG. 16, a battery cell 1610 of a battery pack 1600 may bemounted to avoid a PCB 1660. For example, the battery cell 1610 may bedisposed at least on the same plane as the PCB 1660. However, a PCM unit1630, which is disposed to be weighted to the upper side of the batterycell 1610, may be disposed to be at least partially overlapped with andto be electrically connected to the PCB 1600. In addition, on the PCB1660, a socket device as an electronic component 1670 may be mountedaround an area in which the PCM unit 1630 of the battery pack 1600 isdisposed. According to an embodiment of the present disclosure, thesocket device may accommodate a card-type external device (e.g., a SIMcard, a UIM card, a card-type memory, and the like).

According to various embodiments of the present disclosure, the PCM unit1630 of the battery pack 1600 is disposed to overlap with the topportion of the PCB 1660, and the socket device is disposed in parallelwith the PCM unit 1630 at a side of the PCM unit 1630 so that the wiringspace shortage of the PCB 1660, which is caused due to the PCM unit 1630of the battery pack 1600, can be addressed.

FIGS. 17A and 17B are configuration views illustrating a disposedrelationship between a PCM unit of a battery pack and a PCB of anelectronic device according to various embodiments of the presentdisclosure.

Referring to FIGS. 17A and 17B, a pouch terrace 1730 having a certainwidth and length may be formed on the top of a battery pack 1700.According to an embodiment of the present disclosure, a PCM unit 1731may be disposed at one side of the pouch terrace 1730, and a connectionterminal portion 1732 may be formed to be drawn out by a certain lengthso as to be electrically connected to a PCB 1750 at the other side ofthe pouch terrace 1730. According to an embodiment of the presentdisclosure, the connection terminal portion 1732 may be disposed to beindividually drawn out along the pouch terrace 1730 at a side of thepouch terrace 1730, rather than being directly drawn out from the PCMunit 1731.

According to various embodiments of the present disclosure, the PCM unit1731 may be formed to have a relatively small height and disposed inparallel with the PCB 1750, and the connection terminal portion 1732 maybe electrically connected to a side of the PCB 1750 to avoid the cameradevice 1740. Accordingly, the battery pack 1700 is disposed in a statewhere the connection terminal portion 1732 and the PCM unit 1731 areseparated from the battery cell 1710 so that the volume of the PCM unit1731 can be reduced so as to increase the capacity of the battery pack1700 and the area of the PCB 1750 can be increased so as to secure awiring space.

According to various embodiments of the present disclosure, there isprovided a portable electronic device that may include a front glasscover that forms a front surface of the electronic device, a rear coverthat forms a rear surface of the electronic device, a side surface unitthat surrounds a space that is formed by the front glass cover and therear cover, a display module that is embedded in the space and includesa screen area exposed through the front glass cover, a PCB that isdisposed between the display module and the rear cover, and includes anopening that is at least partially closed, a battery that is installedwithin the opening and interposed between the display module and therear cover, and a PCM that is positioned between the PCB and the displaymodule, and is disposed close to one side of the battery when viewedfrom a position above the PCB.

According to various embodiments of the present disclosure, the rearcover and the side surface unit may be formed integrally with eachother.

According to various embodiments of the present disclosure, the rearcover and the side surface unit may include the same material. Accordingto an embodiment of the present disclosure, the material may be a metal.

According to various embodiments of the present disclosure, theelectronic device may further include a camera module that is disposedclose to the one side of the battery and one side of the PCM when viewedfrom a position above the PCB. The camera module includes a portioninterposed between the display module and the rear cover. The cameramodule may include a lens that is exposed through the rear cover.

According to various embodiments of the present disclosure, theelectronic device may further include a camera flash and/or a biometricsensor which are disposed at the one side of the battery to at leastpartially overlap with the PCM when viewed from a position above thePCB, and are positioned between the PCB and the rear cover.

According to various embodiments of the present disclosure, the PCM andthe camera module are positioned side by side at the one side of thebattery when viewed from a position above the PCB, and at least a partof the camera flash and/or the biometric sensor and the PCM may bepositioned at opposite sides of the PCB, respectively, when viewed froma cross-section.

According to various embodiments of the present disclosure, theelectronic device may further include a camera module that is formedthrough the PCB and disposed close to the one side of the battery whenviewed from a position above the PCB, and includes a lens exposedthrough the rear cover. The PCM may have an L shape that includes afirst portion that is positioned between the camera module and thebattery when viewed from a position above the PCB.

According to various embodiments of the present disclosure, theelectronic device may include at least one physical key button that isdisposed to be at least partially exposed to the outside. According toan embodiment of the present disclosure, the key button may beconfigured as a volume button that is disposed on one side of theelectronic device and performs a volume up/down function. According toan embodiment of the present disclosure, the key button may also bedisposed on the other side of the electronic device and may perform apower ON/OFF function, a wake-up/sleep function, and the like.

A method of assembling a key button according to the related art mayinclude a method of assembling the key button from the outside of theelectronic device, and a method of assembling the key button from theinside of the electronic device.

According to various embodiments of the present disclosure, the methodof assembling the key button from the outside of the electronic deviceis a method in which an FPCB is attached to a main instrument (e.g., thehousing of the electronic device) and the key button is fitted from theoutside. In such a case, it is advantageous in that since the key buttonand the FPCB can be assembled to one instrument, the performances of thekey button, such as the click feeling and the life span of the keybutton, can be performed prior to assembling the electronic device.However, it is disadvantageous in that scratches may occur on theexterior of the electronic device when the button of the key button isassembled from the outside of the electronic device. In addition, whenthe key button is assembled from the outside of the electronic device,the key button may be separated to the outside of the electronic devicesince the locked amount of the key button is small.

According to various embodiments of the present disclosure, the methodof assembling the key button from the inside may include assembling thekey button to the main instrument (e.g., the housing of the electronicdevice) first, assembling the FPCB to the other instrument (e.g., thebracket), and assembling two instruments with each other. In such acase, the key button and the FPCB are assembled to different instruments(e.g., the housing and the bracket). Accordingly, there is adisadvantage in that in order to test the performances of the keybutton, it is necessary to assemble one preassembly (e.g., the assemblyof the housing and the bracket), and when a defect occurs, it isnecessary to dissemble the preassembly again.

According to various embodiments of the present disclosure, it ispossible to provide a key button assembly structure to address theabove-described problems. According to an embodiment of the presentdisclosure, it is possible to provide a key button assembly structurethat can be implemented such that a key performance test is enabled in asingle product state while assembling the key from the inside of theelectronic device.

Hereinafter, a configuration of a key button according to an embodimentof the present disclosure will be described below.

FIGS. 18A and 18B are configuration views of a key button according tovarious embodiments of the present disclosure.

Referring to FIGS. 18A and 18B, a key button 1800 may include a key top1810, and a key base 1820 that is fixed to the key top 1810.

According to various embodiments of the present disclosure, the key top1810 may be formed of at least one of a metal material and a syntheticresin material. According to an embodiment of the present disclosure,the key top 1810 is disposed to be partially exposed to the outside ofthe electronic device (e.g., a side surface) so that a correspondingfunction of the electronic device (e.g., a volume up/down function, awake-up/sleep function, a power ON/OFF function, and the like) may beperformed by the user's pushing operation.

According to various embodiments of the present disclosure, the key base1820 may be fixed to the bottom of the key top 1810. According to anembodiment of the present disclosure, the key base 1820 may serve as alocking member that allows the key top 1810 to be partially exposed fromthe electronic device while preventing the key top 1810 from beingcompletely separated. According to an embodiment of the presentdisclosure, the key base 1820 may include a press portion 1821 that isformed on the bottom surface of the key base 1820 to protrude. Accordingto an embodiment of the present disclosure, the press portion 1821 maybe disposed so as to press a dome key (e.g., a metal dome key) 1852 (seeFIG. 19) that is disposed on an FPCB 1850 (see FIG. 19) of a FPCBassembly 1830 (see FIG. 19) to be described later. According to anembodiment of the present disclosure, the key base 1820 may includesupport pieces 1822 that are formed to protrude on the opposite sides ofthe press portion 1821, respectively. According to an embodiment of thepresent disclosure, the support pieces 1822 may serve to prevent the keytop 1810 from being excessively inserted when the key top 1810 ispressed, and to support the press portion 1821 to smoothly press thedome key 1852. According to an embodiment of the present disclosure, thekey base 1820 may be formed of an elastic material. According to anembodiment of the present disclosure, the key base 1820 may be formed ofat least one of rubber, silicon, and urethane.

According to an embodiment of the present disclosure, the key top 1810and the key base 1820 may be integrally formed as one member using asingle material. Without being limited thereto, however, a member formedof an elastic resin material may be formed on the key top formed as ametallic member, through insert molding.

FIG. 19 is a perspective view illustrating an FPCB assembly in adisassembled state according to various embodiments of the presentdisclosure.

Referring to FIG. 19, the FPCB assembly 1830 may include a support plate1840 and an FPCB 1850 supported by the support plate 1840.

According to various embodiments of the present disclosure, the FPCB1850 may include a circuit body 1851 attached to the support plate 1840,and a connection terminal portion 1853 drawn out from the circuit body1851 and connected to the PCB of the electronic device. According to anembodiment of the present disclosure, on the circuit body 1851, a domekey (e.g., a metal dome key) 1852 may be disposed. According to anembodiment of the present disclosure, the dome key 1852 may be disposedat a position corresponding to the press portion 1821 of theabove-described key base 1810, and may perform an electric switchingfunction by being pressed by the press portion 1821.

According to various embodiments of the present disclosure, the supportplate 1840 may include a plate body 1841 that supports the circuit body1851 of the FPCB 1850, and elastic pieces 1842 that are bent to acertain shape at the opposite ends of the plate body 1841. According toan embodiment of the present disclosure, the elastic pieces 1842 mayhave a “U” shape, and may have an inwardly or outwardly biasedelasticity. According to an embodiment of the present disclosure, theelastic pieces 1842 may have the “U” shape and may have the elasticityto maintain the shape. Accordingly, when the elastic pieces are seatedin elastic piece seating recess 2011 (see FIG. 20A) of a housing to bedescribed later, the phenomenon, in which the support plate 1840 isseparated from the housing, may be prevented in advance. According to anembodiment of the present disclosure, each elastic piece 1842 mayinclude at least one fixing protrusion 1843 that protrudes from theouter surface thereof. The fixing protrusion 1843 may be fixed by beingseated in an opening formed in the elastic piece seating recess 2011 soas to support the fixing of the support plate 1840. According to anembodiment of the present disclosure, the elastic pieces 1842 may beformed in various shapes, such as a “1” shape, a circular shape, an ovalshape, and an “S” shape, besides the “U” shape. According to anembodiment of the present disclosure, the plate body 1841 of the supportplate 1840 and the circuit body 1851 of the FPCB 1850 may be attached toeach other through a method of bonding by using a double-sided tape, andthe like.

FIGS. 20A to 20E are views illustrating a process of installing a keybutton and an FPCB assembly to a housing of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIGS. 20A and 20B, a housing (e.g., the rear housing) 2000of the electronic device may be formed with a key top passage hole 2010.According to an embodiment of the present disclosure, the key toppassage hole 2010 may be formed in a size that allows the key top 1810of the key button 1800 to pass therethrough. According to an embodimentof the present disclosure, the key top passage hole 2010 may be formedin a size that allows only the key top 1810 to pass therethrough andprevents the key base 1820 fixed to the key top 1810 from passingtherethrough. Without being limited thereto, however, a part of the keytop may protrude so as to form a separation prevention flange.

According to various embodiments of the present disclosure, the keybutton 1800 may be lowered from the upper side of the housing 2000 in adirection indicated by the arrow as illustrated in FIG. 20A, and may bemoved forward toward the key top passage hole 2010 as illustrated inFIG. 20B. By such an operation, the key button 1800 may be preventedfrom being completely separated from the key top passage hole 2010 ofthe housing 2000 by the key base 1820, and at the same time, the key top1810 may be disposed such that the key top 1810 is partially exposed tothe outside of the housing 2000 through the key top passage hole 2010.

Referring to FIG. 20C, while the key top 1810 of the key button 1800 isstill partially passing through the key top passage hole 2010 of thehousing 2000, the FPCB assembly 1830 may be mounted from the rear sidein the direction indicated by the arrow. In such a case, the elasticpieces 1842, which are formed on the opposite ends of the support plate1840 of the FPCB assembly 1830, may be tightly seated in the elasticpiece seating recess 2011 that is formed in the housing 2000. This isbecause the elastic pieces 1842 are seated in the elastic piece seatingrecess 2011 while maintaining the outwardly biased elastic force.According to an embodiment of the present disclosure, each elastic pieceseating recess 2011 may be formed with an opening (not illustrated), andthe fixing protrusions 1843, which are formed to protrude from theelastic pieces 1842, respectively, may be seated in the openings,respectively, so as to support the support plate 1840 to be fixed to thehousing 2000. According to an embodiment of the present disclosure, theplate body 1841 of the support plate 1840 may include a fixing plate1844 that is formed to extend orthogonally to the plate body 1841.According to an embodiment of the present disclosure, when the supportplate 1840 is fixed to the housing 2000, the fixing piece 1844 is seatedin a fixing piece seating recess 2012 that is formed on the innersurface of the housing 2000, so that the support plate 1840, which ismounted on the housing 2000, can be prevented from moving left and rightin advance.

Referring to FIGS. 20D and 20E, the key button 1800 mounted on thehousing 2000 may hold the key top 1810 in the state in which the key top1810 is partially exposed to the outside of the housing 2000, and thekey button 1800 may be supported by the support plate 1840 of the FPCBassembly 1830 behind the key button 1800. According to an embodiment ofthe present disclosure, the press portion 1821, which is formed on thekey base 1820 of the key button 1800, may maintain the state in whichthe press portion 1821 is in contact with the dome key 1852 of thecircuit body 1851 that is supported by the plate body 1841 of the FPCBassembly 1830. In such a case, because the elastic pieces 1842 that areformed on the opposite ends of the support plate 1840 are fixed to theelastic piece seating recess 2011 formed in the housing 2000, thesupport plate 1840 is not moved back even if the key button 1800 ispressed, and by pressing the press portion 1821 of the key base 1820,only the dome key 1852, which is disposed on the circuit body 1851 ofthe FPCB 1850, may be pressed to be capable of being switched.

According to various embodiments of the present disclosure, because thepressing operation of the key top 1810 is implemented only by thesupport plate 1840 of the FPCB assembly 1830 without any otherinstrument (e.g., the bracket) in the state where the key button 1800 isassembled inside the housing 2000, the performance test of the keybutton 1800 can be easily implemented.

FIGS. 21A to 21D are configuration views illustrating a principalportion in a state where an FPCB assembly is installed in a housing ofan electronic device according to various embodiments of the presentdisclosure. For the same constituent elements as those described above,descriptions will be omitted.

Referring to FIGS. 21A to 21D, the support plate 1840 of the FPCBassembly 1830 may be firmly fixed at the opposite ends thereof by theelastic pieces 1842, but may be moved left and right in the fixed state.Accordingly, on the plate body 1841 of the support plate 1840, thefixing piece 1844 may be bent in the direction orthogonal to the platebody 1841, and when the support plate 1840 is fixed to the housing 2000,the fixing piece 1844 may also be seated in the fixing piece seatingrecess 2012 that is formed in the housing 2000.

According to an embodiment of the present disclosure, the fixing pieceseating recess 2012 may be formed in the form of an opening thatpenetrates the bottom surface of the housing 2000, and when the fixingpiece 1844 is applied to the fixing piece seating recess 2012, thefixing piece 1844 may be seated such that the surface of the fixingpiece 1844 and the bottom surface of the housing 2000 are flush witheach other. According to an embodiment of the present disclosure, thefixing piece 1844 is formed in a rectangular shape. Without beinglimited thereto, however, the fixing piece 1844 may be formed in variousangled shapes so as to prevent the support plate 1840 from being movedleft and right. According to an embodiment of the present disclosure,one fixing piece 1844 is formed on the plate body 1841 of the supportplate 1840. However, in the case where the plate body 1841 and a spaceof the housing 2000, which corresponds to the plate body 1841, areavailable, a plurality of fixing pieces 1844 may be formed.

FIG. 22 is a perspective view of an FPCB assembly in a disassembledstate according to various embodiments of the present disclosure.

Referring to FIG. 22, the above-mentioned FPCB assembly 1830 has beenillustrated and described above with reference to one key button 1800,an FPCB 1850 having one dome key 1852 applied to the key button 1800,and a support plate 1840 that supports the FPCB 1850. FIG. 22illustrates one FPCB assembly 2230 having two dome keys 2252 and 2253that simultaneously support two key buttons 1800 that are separatelyapplied, and hereinafter, the FPCB assembly 2230 will be described.Accordingly, the configuration of each of the two separately applied keybuttons 1800 is the same as that of the key button 1800 illustrated inFIGS. 18A and 18B. Thus, the detailed descriptions for the configurationof the key buttons 1800 will be omitted.

Referring to FIG. 22, the FPCB assembly 2230 may include a support plate2240 and an FPCB 2250 supported by the support plate 2240.

According to various embodiments of the present disclosure, the FPCB2250 may include a circuit body 2251 attached to the support plate 2240,and a connection terminal portion 2254 drawn out from the circuit body2251 and connected to the PCB of the electronic device. According to anembodiment of the present disclosure, one pair of dome keys (e.g., metaldome keys) 2252 and 2253 may be disposed on the circuit body 2251 at acertain interval. According to an embodiment of the present disclosure,the one pair of dome keys 2252 and 2253 may be disposed at the positionscorresponding to the press portions 1821, which are formed on the keybases 1820 of the individual key buttons 1800, respectively, and may bephysically operated by pressing the press portions 1821 so as to performan electric switching function.

According to various embodiments of the present disclosure, the supportplate 2240 may include a plate body 2241 that supports the circuit body2251 of the FPCB 2250, and elastic pieces 2242 that are bent in acertain shape on the opposite ends of the plate body 2241, respectively.According to an embodiment of the present disclosure, the elastic pieces2242 may have a “U” shape and may have elasticity so that the legportions of the “U” are biased to the outside in relation to each other.Accordingly, when the elastic pieces 2242 are seated in an elastic pieceseating recess 2314 (see FIG. 23A) in a housing 2300 to be describedlater (see FIG. 23A), it is possible to prevent the support plate 2240from being separated from the housing 2300 in advance. According to anembodiment of the present disclosure, each elastic piece 2242 mayinclude at least one fixing protrusion 2243 that protrudes from theouter surface thereof, and the fixing protrusion 2243 may be fixedlyseated in an opening formed in the elastic piece seating recess 2314 soas to assist the fixing of the support plate 2240. According to anembodiment of the present disclosure, the elastic pieces 2242 may beformed in various shapes that may exert elasticity, such as a “

” shape, a circular shape, an oval shape, and an “S” shape besides the“U” shape, by bending. According to an embodiment of the presentdisclosure, the plate body 2241 of the support plate 2240 and thecircuit body 2251 of the FPCB 2250 may be attached to each other througha method of bonding a double-sided tape, and the like.

FIGS. 23A to 23E are views illustrating a process of installing keybuttons and an FPCB assembly to a housing of the electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIGS. 23A and 23B, in a housing (e.g., a rear housing) 2300of the electronic device, one pair of key top passage holes 2311 and2312 may be formed at a certain interval. According to an embodiment ofthe present disclosure, the one pair of key top passage holes 2311 and2312 may be formed to have a size that allows the key tops 1810 of thekey buttons 1800 to pass through the key top passage holes 2311 and2312, respectively. According to an embodiment of the presentdisclosure, the key top passage holes 2311 and 2312 may be formed tohave a size that allows only the key tops 1810 to pass through the keytop passage holes 2311 and 2312, respectively, and to prevent the keybases 1820 fixed to the key tops 1810 from passing the key top passageholes 2311 and 2312. Without being limited thereto, however, a part ofeach key top is formed to protrude so as to form a separation preventionflange.

According to various embodiments of the present disclosure, the keybuttons 1800 may be lowered from the upper side of the housing 2300 inthe direction indicated by an arrow as illustrated in FIG. 23A, and maybe moved forward toward the key top passage holes 2311 and 2312,respectively, as illustrated in FIG. 20B. Through such an operation, thekey buttons 1800 may be prevented from being completely separated fromthe key top passage holes 2311, 2312 of the housing 2300 by the keybases 1820, respectively, and at the same time, may be disposed suchthat the key tops 1810 are partially expose to the outside of thehousing 2300 through the key top passage holes 2311 and 2312,respectively.

Referring to FIG. 23C, in the state where the key tops 1810 of the onepair of key buttons 1800 partially pass through the key top passageholes 2311 and 2312 of the housing 2300, respectively, the FPCB assembly2230 may be mounted in the direction indicated by an arrow on the rearside of the key tops 1810. In such a case, the elastic pieces 2242formed on the opposite ends of the support plate 2240 of the FPCBassembly 2230 may be tightly seated in the elastic piece seating recess2314 formed in the housing 2300. This is because the elastic pieces 2242are seated in the elastic piece seating recess 2314 while maintaining anoutwardly biased elasticity. According to an embodiment of the presentdisclosure, the elastic piece seating recess 2314 may be formed withopenings (not illustrated) and the fixing protrusions 2243, which areformed to protrude from the elastic pieces 2242, respectively, may beseated in the openings, respectively, so as to assist the support plate2240 to be fixed to the housing 2300. According to an embodiment of thepresent disclosure, a plate support piece 2313 may be formed to protrudeinside the housing 2300 so that the plate support piece 2313 can supportthe rear side of the plate body 2241 of the support plate 2240 as beingmounted. According to an embodiment of the present disclosure, the platesupport piece 2313 may prevent the support plate 2240 itself from beingelastically moved backward in advance when the relatively long supportplate 2240 is pressed by the key buttons 1800. According to anembodiment of the present disclosure, the plate support piece 2313 ispreferably disposed between the one pair of key top passage holes 2311and 2312, and a plurality of plate support pieces may be formed if aforming space is available.

Referring to FIGS. 23D and 23E, the one pair of key buttons 1800 mountedin the housing 2300 may be maintained in the state where each of the keytops 1810 of the key buttons 1800 is partially exposed to the outside ofthe housing 2300, and the key buttons 1800 may be supported by thesupport plate 2240 of the FPCB assembly 2230 from the rear side thereof.According to an embodiment of the present disclosure, the press portions1821, which are respectively formed on the key bases 1820 of the keybuttons 1800, may be maintained in the state of being respectively incontact with the dome keys 2252 and 2253 of the circuit body 2251 thatis supported by the plate body 2240 of the FPCB assembly 2230. In such acase, because the elastic pieces 2242 formed on the opposite ends of thesupport plate 2240 are fixed to the elastic piece seating recess 2314formed in the housing 2300, the support plate 2240 is not moved backwardeven if the key buttons 1800 are pressed, and only the dome keys 2252and 2253 disposed on the circuit body 2251 of the FPCB 2250 can bephysically switched by pressing the press portions 1821 of the key bases1820.

According to various embodiments of the present disclosure, because thepressing operation of the key tops 1810 can be implemented only by thesupport of the support plate 2240 of the FPCB assembly 2230 without anyother separate instrument (e.g., the bracket) in the state where the keybuttons 1800 are assembled in the inside of the housing 2300, theperformance test of the key buttons 1800 can be easily implemented.

FIGS. 24A to 24D are configuration views illustrating a principalportion in a state where an FPCB assembly is installed to a housing ofan electronic device according to various embodiments of the presentdisclosure. Descriptions for the same constituent elements as thosedescribed above will be omitted.

Referring to FIGS. 24A to 24D, the support plate 2240 of the FPCBassembly 2230 may be rigidly fixed by the elastic pieces 2242 that areformed on the opposite ends thereof. However, because two key buttons1800 are accommodated, the support plate 2240 can be moved backward bypressing the key buttons 1800. Accordingly, protrusion operations 2244may be formed to extend at a certain interval on the plate body 2241 ofthe support plate 2240, and the protrusion operations 2244 may beinserted into protrusion operation insertion recess 2314 formed in thebottom of the housing 2300, respectively. In such a case, the protrusionoperations 2244 of the support plate 2240 may be supported by contactoperations 2315, respectively, which are formed by the periphery of theprotrusion operation insertion recess of the protrusion operationinsertion recess 2314, which is formed in a manner of being perforated.According to an embodiment of the present disclosure, the protrusionoperations 2244 of the support plate 2240 may be disposed such that theyare supported at least not to protrude from the protrusion operationinsertion recess 2314 of the housing 2300 after being inserted into theprotrusion operation insertion recess 2244 of the housing 2300.

FIGS. 25A and 25C are configuration views illustrating a principalportion in a state where key buttons and an FPCB assembly are installedaccording to various embodiments of the present disclosure.

Referring to FIGS. 25A to 25C, the key buttons 1800 may be installed tothe housing 2300 of the electronic device to partially protrude.According to an embodiment of the present disclosure, in the state wherethe key tops 1810 of the key buttons 1800 are exposed to the outside ofthe housing 2300, the support plate 2240 of the FPCB assembly 2230 canbe disposed to support the key buttons 1800 at the rear side of the keybuttons 1800. In such a state, the press portions 1821 formed on the keybases 1820 of the key buttons 1800 maintain the state in which they arerespectively in contact with the dome keys 2522 disposed on the FPCB2250 of the FPCB assembly 2230, and the connection terminal portion 2254of the FPCB 2250 may bypass to the rear side of the support plate 2240so as to maintain the state in which the connection terminal portion2254 of the FPCB 2250 is electrically connected to the PCB 2500 of theelectronic device.

According to various embodiments of the present disclosure, because thekey buttons 1800 and the FPCB assembly 2230 are disposed together in thehousing 2300, which is one single product, so that the key buttons 1800can be assembled to the housing without assembling a separate structure(e.g., a bracket, and the like), there is an advantageous effect in theperformance test of the key buttons 1800.

FIGS. 26A and 26B are configuration views of a key button according tovarious embodiments of the present disclosure.

Referring to FIGS. 26A and 26B, a key button 2600 may include a key top2610 having a certain length, and key bases 2620 that are disposed onthe opposite ends of the key top 2610, respectively. According to anembodiment of the present disclosure, each of the key bases 2620 may bedisposed to correspond to the FPCB assembly 2230 that includes the FPCB2250, on which one pair of dome keys 2252 and 2253 as in theconfiguration of FIG. 22, and a press portion 2622 formed on each of thekey bases 2620 may have a configuration that presses a corresponding oneof the dome keys 2252 and 2253 of the FPCB assembly 2230. According toan embodiment of the present disclosure, a key flange 2621 may be formedto extend outwardly from each key base 2620. According to an embodimentof the present disclosure, the key flange 2621 may serve to restrain thekey base 2620 to be locked when the key top 2610 passes through a keytop passage hole 2701 (see FIG. 27A) formed in the housing 2700 (seeFIG. 27A).

FIGS. 27A to 27D are views illustrating a process of installing a keybutton and an FPCB assembly to a housing of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIGS. 27A and 27B, the housing (e.g., a rear housing) 2700of an electronic device may be formed with a key top passage hole 2701.According to an embodiment of the present disclosure, the key toppassage hole 2701 may be formed to have a size that allows the key top2610 of the key button 2600 to pass therethrough. According to anembodiment of the present disclosure, the key top passage hole 2701 maybe formed to have a size that allows only the key top 2610 to passtherethrough and prevent the key flanges 2621 formed on the key base2620 from passing therethrough.

According to various embodiments of the present disclosure, the keybutton 2600 may be lowered from the upper side of the housing 2700 inthe direction indicated by the arrow, as illustrated in FIG. 27A, andthe key button 2600 may be moved forward toward the key top passage hole2701, as illustrated in FIG. 27B. By this operation, the key button 2600may be prevented from being completely separated from the key toppassage hole 2701 of the housing 2700 by the key flanges 2621, and atthe same time, the key button 2600 may be disposed such that the key top2610 is partially exposed to the outside of the housing 2700 through thekey top passage hole 2701. According to an embodiment of the presentdisclosure, the key button 2600 may have a “

”-shaped opened portion 2601 formed at the center thereof, and a keybutton accommodation piece 2702 may be formed in the housing 2700 toprotrude upwardly. Accordingly, when the key button 2600 passes throughthe key top passage hole 2701 of the housing 2700, the key buttonaccommodation piece 2703 is accommodated in the opened portion 2601 sothat the key button 2600 can be easily assembled.

Referring to FIGS. 27C and 27D, the FPCB assembly 2630 can be mounted inthe direction indicated by the arrow at the rear side while maintainingthe state in which the key top 2610 of the key button 2600 has partiallypassed through the key top passage hole 2701 of the housing 2700. Insuch a case, the elastic pieces 2642, formed on the opposite ends of theplate body 2641 of the support plate 2640 of the FPCB assembly 2630, maybe tightly seated in the elastic piece seating recess 2703 that isformed in the housing 2700. This is because, the elastic pieces 2642 areseated in the elastic piece seating recesses 2703 while maintaining anoutwardly biased elasticity.

According to various embodiments of the present disclosure, because thepressing operation of the key top 2610 is implemented only by thesupport of the support plate 2640 of the FPCB assembly 2630 without anyother separate instrument (e.g., a bracket) in the state where the keybutton 2600 is assembled in the inside of the housing 2700, theperformance test of the key button 2600 can be easily implemented.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes a frontglass cover that forms a front surface of the electronic device, a rearcover that forms a rear surface of the electronic device, a bezel thatsurrounds a space formed by the front cover and the rear cover, andincludes a first portion that includes an opening, a display device thatis embedded in the space, and includes a screen area that is exposedthrough the front cover, and a plate that includes a planar surface thatis parallel with the front cover within the space, and includes a firstprotrusion and a second protrusion that are disposed close to theopening and are spaced apart from each other.

The first protrusion and the second protrusion are disposed to provide apassage that leads to the opening.

The electronic device further includes a key that has a size and a shapethat enable the key to pass through the passage and the opening, and isinserted into the passage and the opening to be movable in a firstdirection, a first member (elongated member) that is attached to orintegrally formed with a surface of the key opposite to the surface ofthe key, which is exposed to the outside of the electronic device, so asto prevent the key from being pulled out to the outside, and a secondmember including, within the space, a central portion that extends in asecond direction perpendicular to the first direction, a first elasticend portion that extends from one end of the central portion and isdisposed between the first portion and the first protrusion, and asecond elastic end portion that extends from the other end of thecentral portion, and is disposed between the first portion and thesecond protrusion.

The first member is inserted into a gap between the key and the centralportion.

According to various embodiments of the present disclosure, the firstprotrusion and the second protrusion may not be in contact with thefirst portion.

According to various embodiments of the present disclosure, at least oneof the first end portion and the second end portion may have a U-shape.

According to various embodiments of the present disclosure, theelectronic device may further include an electric component that isinserted into a gap between the first member and the central portion anddetects the movement of the key, and at least one wire that extends fromthe component.

According to various embodiments of the present disclosure, the platemay be integrally formed with the bezel.

According to various embodiments of the present disclosure, the rearcover and the side surface portion may be integrally formed with eachother.

According to various embodiments of the present disclosure, the rearcover and the side surface portion may include the same material.

According to various embodiments of the present disclosure, the materialmay be a metal.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes a frontglass cover that forms a front surface of the electronic device, a rearcover that forms a rear surface of the electronic device, a bezel thatsurrounds a space formed by the front cover and the rear cover, andincludes a first portion that includes a first opening and a secondopening, a display device that is embedded in the space, and includes ascreen area that is exposed through the front cover, and a plate thatincludes a planar surface that is parallel with the front cover withinthe space, and includes a first protrusion, a second protrusion, and athird protrusion, which are disposed close to the opening and are spacedapart from each other. The second protrusion is interposed between thefirst protrusion and the third protrusion.

The first protrusion and the second protrusion are disposed to provide afirst passage that leads to the first opening without being in contactwith the first portion.

The second protrusion and the third protrusion are disposed to provide asecond passage that leads to the second opening without being in contactwith the first portion.

The electronic device further includes a first key that has a size and ashape that enable the first key to pass through the first passage andthe first opening, and is inserted into the first passage and the firstopening to be movable in a first direction, a second key that has a sizeand a shape which enable the second key to pass through the secondpassage and the second opening, and is inserted into the second passageand the second opening to be movable in the first direction, a first keymember (elongated member) that is attached to or integrally formed witha surface of the first key opposite to the surface of the first key,which is exposed to the outside of the electronic device, so as toprevent the first key from being pulled out to the outside, a second keymember (elongated member) that is attached to or integrally formed witha surface of the second key opposite to the surface of the second key,which is exposed to the outside of the electronic device, so as toprevent the second key from being pulled out to the outside, and asecond member that includes, within the space, a central portion thatextends in a second direction perpendicular to the first direction, afirst elastic end portion that extends from one end of the centralportion and is disposed between the first portion and the firstprotrusion, and a second elastic end portion that extends from the otherend of the central portion, and is disposed between the first portionand the third protrusion.

The first key member is inserted into a gap between the first key andthe central portion, and the second key member is inserted into a gapbetween the second key and the central portion.

According to various embodiments of the present disclosure, it ispossible to provide a method of manufacturing an electronic device thatincludes A) an operation of providing a bezel that surrounds an innermounting space of the electronic device and a plate that is connectedwith the bezel, in which the bezel includes a first portion thatincludes an opening formed through a portion of the bezel, the platethat includes a planar surface that is parallel with the front coverwithin the space, and includes a first protrusion and a secondprotrusion that are disposed close to the opening and are spaced apartfrom each other, the first protrusion and the second protrusion beingconfigured to form a passage that leads to the opening without being incontact with the first portion, B) an operation of inserting a keythrough the passage and the opening such that at least a part of the keyis exposed to the outside of the electronic device, C) an operation ofpreventing the key from being pulled out to the outside by using a firstmember (elongated member) that is attached to or integrally formed witha surface of the key opposite to the surface of the key, which isexposed to the outside of the electronic device, and includes one endportion that extends in a first direction parallel to the longitudinaldirection of the first portion, and the other end portion that extendsin the first direction and is formed at the opposite side to the one endportion so as to prevent the key from being pulled out to the outside,and D) an operation of inserting a second member including, within thespace, a central portion that extends in the first direction, a firstend portion that extends in the first direction and is disposed betweenthe first portion and the first protrusion, and a second end portionthat extends in the first direction and is disposed between the firstportion and the second protrusion.

According to various embodiments of the present disclosure, the methodmay further include an operation of providing a rear cover that formsthe rear surface of the electronic device.

According to various embodiments of the present disclosure, the methodmay further include an operation of providing a front glass cover thatforms the front surface of the electronic device.

According to various embodiments of the present disclosure, theelectronic device may include a home key button on the front surface.According to an embodiment of the present disclosure, the home keybutton facilitates an efficient operation of the electronic device usingfingerprint recognition by mounting a fingerprint recognition sensor onthe outer surface of the home key button, in addition to a wake-upfunction and a return-to-home screen function of the electronic device.

In general, when the fingerprint recognition sensor is provided in thehome key button, the fingerprint recognition sensor may be mounted on anFPCB that passes through the home key button, and the FPCB may have aconfiguration that is electrically connected with a PCB of theelectronic device along the lower side of the home key button. In such acase, because the FPCB is off-centered to one side of the home keybutton to bypass to the lower side of the home key button, there was anissue in that when a portion of the home key button, through which theFPCB passes, is pressed, the click feeling becomes weighty, and when aportion of the home key button, through which the FPCB does not pass, ispressed, the click feeling becomes lighter.

An embodiment of the present disclosure may provide a home key buttonfor addressing the above-described issues. According to an embodiment ofthe present disclosure, the various embodiments of the presentdisclosure may always provide a constant click feeling even when anyportion of the home key button is pressed.

FIGS. 28A to 28D are configuration views illustrating a configuration ofa home key button of an electronic device according to variousembodiments of the present disclosure.

Referring to FIG. 28A, a home key button 2800 may include an FPCB 2810,a fingerprint recognition sensor 2820 that is disposed above andconnected with the FPCB 2810, and a support plate 2830 including anactuator 2831 (see FIG. 29A) that is disposed below the FPCB 2810 so asto press a dome key positioned below the actuator 2831 when the home keybutton 2800 is pressed. According to an embodiment of the presentdisclosure, the home key button 2800 may further include a decorationmember 2840 that is engaged with the support plate 2830, on which theFPCB 2810 is disposed.

According to various embodiments of the present disclosure, thedecoration member 2840 may include a sensor exposing port 2841 at thecenter thereof, and may be engaged with the support plate 2830 such thatthe fingerprint recognition sensor 2820 is exposed. According to anembodiment of the present disclosure, the decoration member 2840 may beformed of a metal material. According to an embodiment of the presentdisclosure, the decoration member 2840 may be formed by plating chromeon a synthetic resin material. According to an embodiment of the presentdisclosure, when the decoration member 2840 is mounted on the frontsurface of the electronic device, at least a part of the periphery ofthe front surface is exposed to the outside so that the decorationmember 2840 can not only give prominence to the home key button 2800 onthe electronic device, but can also contribute to the configuration ofthe beautiful exterior of the electronic device. According to anembodiment of the present disclosure, the decoration member 2840 mayserve to prevent the home key button 2800 from being completelyseparated to the outside by being caught to the inner surface of thehousing of the electronic device.

According to various embodiments of the present disclosure, the FPCB2810 may include a sensor mounting unit 2811 that accommodates thefingerprint recognition sensor 2820 and is electrically connected to thefingerprint recognition sensor 2820, a diffraction unit 2812 that isformed to extend from the sensor mounting unit 2811, and is attached tothe bottom surface of the support plate 2830 bypassing a molded portion,the diffraction unit 2812 including a through hole 2814, and aconnecting portion 2813 that is formed to extend from the diffractionunit 2812 and may be electrically connected to the PCB avoiding thedisplay of the electronic device. According to an embodiment of thepresent disclosure, the connecting portion 2813 may further include aposition fixing hole 2815, into which a protrusion formed in the housingof the electronic device may be inserted so as to fix the position ofthe home key button 2800 when the home key button 2800 is applied to theelectronic device. According to an embodiment of the present disclosure,an end portion of the connecting portion 2813 may further include aconnecting terminal that is connected with the PCB.

According to various embodiments of the present disclosure, the supportplate 2830 may be formed by a metal member. According to an embodimentof the present disclosure, the support plate 2830 may be formed of amaterial, such as STS or aluminum. According to an embodiment of thepresent disclosure, the support plate 2830 may include the actuator 2831on the bottom surface thereof, which protrudes downwardly. According toan embodiment of the present disclosure, the actuator 2831 may serve asthe press portion for physically pressing the dome key disposed belowthe actuator 2831 when the home key button 2800 is mounted in theelectronic device.

According to various embodiments of the present disclosure, it has beendescribed that the fingerprint recognition sensor 2820 is disposed onthe home key button 2800, but the present disclosure is not limitedthereto. For example, various sensor modules (e.g., an HRM sensor) maybe provided in place of the fingerprint recognition sensor 2820 or inaddition to the fingerprint recognition sensor 2820. According to anembodiment of the present disclosure, various light emitting members,such as an LED indicator, may be applied in place of the fingerprintrecognition sensor.

Referring to FIGS. 28B and 28C, the FPCB 2810 and the fingerprintrecognition sensor 2820 may be fixed to each other by being molded usinga synthetic resin, and electrically connected with each other. Accordingto an embodiment of the present disclosure, only the FPCB 2810 may beformed by being insert-molded by a member of a synthetic resin material,and the fingerprint recognition sensor 2820 may be disposed on the topthereof by being attached thereto. According to an embodiment of thepresent disclosure, a decoration member 2840 may be further stacked onthe fingerprint recognition sensor 2820. In such a case, the decorationmember 2840 may be fixed to a molding including the FPCB 2810 by amethod of bonding by using a double-sided tape, and the like. Accordingto an embodiment of the present disclosure, the top surface of thefingerprint recognition sensor, which is exposed through the decorationmember 2840, may be formed through a UV molding process.

Referring to FIG. 28D, the home key button 2800 may be disposed in thehousing 2850 of the electronic device. According to an embodiment of thepresent disclosure, the home key button 2800 may be disposed such thatthe fingerprint recognition sensor 2820 is exposed to the upper sidethereof through the opening 2841 of the decoration member 2840, andbelow the home key button 2800, the diffraction unit 2812 of the FPCB2810 is disposed such that the diffraction unit 2812 is bent to thelower side of the home key button downward. This is to address theissues that when the FPCB 2810 is formed in a linear form, the FPCB 2810may overlap with the display, and when the FPCB 2810 is linearly fixed,the length of the portion of the FPCB 2810, which is fixed to thehousing, is reduced, thereby deteriorating the click feeling. Accordingto an embodiment of the present disclosure, in the connecting portion2813 of the FPCB 2810, one pair of position fixing holes 2815 and 2816may be formed so that the protrusions formed in the housing 2850 can beinserted into the holes 2815 and 2816 so as to fix the position of theconnecting portion 2813.

FIGS. 29A and 29B are configuration views illustrating an installationand operation relationships of a home key button of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIGS. 29A and 29B, the home key button 2800 may beinstalled to be restrained in such a manner that locking pieces 2842 ofthe decoration member 2840 are engaged with the housing 2850 of theelectronic device. According to an embodiment of the present disclosure,the home key button 2800 may be disposed such that the fingerprintrecognition sensor 2820 is exposed to the upper side of the decorationmember 2840, and the sensor mounting unit 2811 of the FPCB 2810, whichis insert-molded to the molding portion, may be disposed below the homekey button 2800. According to an embodiment of the present disclosure,the support plate 2830 may be disposed below the molding portion.According to an embodiment of the present disclosure, the diffractionunit 2812 of the FPCB 2810, which is drawn out from the molding portion,may be disposed across the center of the bottom surface of the supportplate 2830. In such a case, the diffraction unit 2812 of the FPCB 2810may be tightly attached to the bottom surface of the support plate 2830in a manner where the actuator 2831 of the support plate 2830 passesthrough the through-hole 2814. According to an embodiment of the presentdisclosure, the diffraction unit 2812 of the FPCB 2810 may be attachedto the bottom surface of the support plate 2830 by a method of bondingby using a double-sided tape, and the like.

According to various embodiments of the present disclosure, the home keybutton 2800 may be restrained without breaking away to the outside ofthe electronic device as the locking pieces 2842, which is formed toextend from the opposite ends of the decoration member 2840, are engagedwith the housing 2850. In such a case, the deviation of upper and lowerclick feelings of the home key button 2800 can be reduced when thelength of the locking pieces 2842 in the width direction of the home keybutton 2800 is lengthened.

FIG. 30 is a view illustrating a fixing relationship of an FPCB that isprovided on a home key button according to various embodiments of thepresent disclosure.

Referring to FIG. 30, the home key button 2800 may be disposed in thehousing 2850 of the electronic device. According to an embodiment of thepresent disclosure, the FPCB 2810 may include a diffraction unit 2812that bypasses the center of the support plate 2830 under the fingerprintrecognition sensor 2820, and a connecting portion 2813 that extends fromthe diffraction unit 2812 toward the display and is bent again.According to an embodiment of the present disclosure, the connectingportion 2813 may be disposed to be spaced apart from each other by acertain interval so as to prevent a white point phenomenon of the LCD.According to an embodiment of the present disclosure, the bent area inthe connecting portion 2813, which includes a first position fixing hole2815, excludes a adhesion process (excluding the use of a double-sidedtape) so as to prevent the deterioration of the click feeling of thehome key button 2800 in advance. According to an embodiment of thepresent disclosure, a second position fixing hole 2816 may be disposedalong the bent portion of the connecting portion 2813 at a certaindistance from the first position fixing hole 2815. According to anembodiment of the present disclosure, in an area of the connectingportion 2813 between the first position fixing hole 2815 and the secondposition fixing hole 2816, a hardware component for the home key button2800 may be mounted.

FIGS. 31A and 31B are configuration views of a home key button of anelectronic device according to various embodiments of the presentdisclosure.

Referring to FIGS. 31A and 31B, in a home key button 3100, a fingerprintrecognition sensor 3120 is disposed at the upper portion of a decorationmember 3140 to be exposed, and an FPCB 3110 may be staked at the lowerside thereof. According to embodiment of the present disclosure, theFPCB 3110 may include a sensor mounting unit 3111 that is molded to thedecoration member 3140 and mounted together with the decoration member3140, and a diffraction unit 3112 that is drawn out from the sensormounting unit 3111 and extends to the bottom of the home key button3100, thereby bypassing the home key button 3100. According to anembodiment of the present disclosure, the diffraction unit 3112 may bedisposed at the center of the bottom surface of the support plate 3130which is mounted on the bottom of the home key button 3100. According toan embodiment of the present disclosure, the FPCB 3110 may furtherinclude a connecting portion that is drawn out from the diffraction unit3112 and is bent a plurality of times so as to avoid a display.

According to various embodiments of the present disclosure, a switchingdome 3114 may be disposed at the center of the diffraction unit 3112 ofthe FPCB 3110. According to an embodiment of the present disclosure, theswitching dome 3114 may be a metal dome. Accordingly, when the home keybutton 3100 is pressed after having been installed to the electronicdevice, the switching dome 3114 may be supported by a correspondinginstrument (e.g., a bracket) 3150 of the electronic device so as toperform a switching operation.

FIGS. 32A to 32C are configuration views illustrating a home key buttoninstalled to a wearable electronic device according to variousembodiments of the present disclosure.

Referring to FIGS. 32A to 32C, a home key button according to anembodiment of the present disclosure may be applied to a wearableelectronic device. According to an embodiment of the present disclosure,the wearable electronic device may be a wrist-wearable electronic devicethat may be worn on a user's wrist. According to an embodiment of thepresent disclosure, the home key button applied to the wearableelectronic device may be implemented in a waterproof structure.

Referring to FIG. 32A, a wearable electronic device 3200 may include amain body 3210, and one pair of straps 3220 that installed to extendfrom the opposite ends of the main body 3210 so as to be worn on theuser's wrist. According to an embodiment of the present disclosure, adisplay 3211 may be disposed on the main body 3210, and the home keybutton 3230 according to the embodiment of the present disclosure may bedisposed below the display 3211. According to an embodiment of thepresent disclosure, the straps 3220 may have a plurality of lengthadjustment openings 3221 that are formed at certain intervals therein soas to guide the user to wear the main body to be suitable for the user'swrist.

Referring to FIGS. 32B and 32C, the basic configuration of the home keybutton 3230 applied to the wearable electronic device 3200 may include aleft-right symmetric arrangement structure in which the FPCB 3240 passesthrough the center of the bottom surface of the home key button 3230, asdescribed above. According to an embodiment of the present disclosure,in the home key button 3230, the fingerprint recognition sensor may bedisposed in the upper portion of the decoration member to be exposed,and the FPCB 3240 may be stacked at the lower side thereof.

According to various embodiments of the present disclosure, the FPCB3240 may include a sensor mounting unit that is molded to the decorationmember and mounted together with the decoration member, and adiffraction unit that is drawn out from the sensor mounting unit andextends to the bottom side of the home key button, bypassing the homekey button. According to an embodiment of the present disclosure, thediffraction unit may be disposed at the center of the bottom surface ofthe support plate 3250 that is installed to the bottom of the home keybutton. According to an embodiment of the present disclosure, the FPCB3240 may further include a connecting portion that is drawn out from thediffraction unit 3242 and is bent a plurality of times so as to avoidthe display. According to an embodiment of the present disclosure, thediffraction unit 3242 may include a through-hole 3243 that allows theactuator 3251 of the support plate 3250 to pass therethrough. Accordingto an embodiment of the present disclosure, the diffraction unit 3242may be fixed by being attached to the bottom surface of the supportplate 3250 by a tape 3244.

According to various embodiments of the present disclosure, the home keybutton 3230 may include a waterproof structure because the home keybutton 3230 is disposed on the front surface of the main body 3210 thatincludes the display of the wearable electronic device 3200. Accordingto an embodiment of the present disclosure, on the bottom portion of awindow around the home key button 3230, a print film 3271, an OCA 3272,and a TSP 3273 may be sequentially stacked to be used as a part of thedisplay.

According to various embodiments of the present disclosure, a waterproofmember 3280 formed of an elastic material may be disposed to completelyenclose the support plate 3250 on the bottom portion of the home keybutton. According to an embodiment of the present disclosure, thewaterproof member 3280 may be attached to the bottom surface of thewindow 3270 by one or more waterproof tapes 3274 and 3276, and a PCsheet 3275. According to an embodiment of the present disclosure, thewaterproof member 3280 may be formed of at least one of urethane,silicon, and rubber. Accordingly, even if the home key button 3230 ispressed, the elastic waterproof member 3280 may be pushed downwardly bythe support plate 3250 while maintaining the waterproof function.

According to various embodiments of the present disclosure, the housingof the electronic device may be manufactured through dual injectionmolding of dissimilar materials. According to an embodiment of thepresent disclosure, the housing may be formed by insert-molding anon-metal member to a metal member. According to an embodiment of thepresent disclosure, the non-metal member may be formed of a syntheticresin member.

According to various embodiments of the present disclosure, anelectronic device that includes a housing including a metal portion inat least an area thereof may require an electric connection structurebetween a PCB disposed in the inner space of the electronic device andan antenna radiator that is generally disposed on the outer surface ofthe electronic device. Because the existing electric connectionstructures of an antenna carrier type, a laser direct structuring (LDS)type, and an FPCB type include a flexible antenna radiator so that theycan be vertically connected to a pattern surface, and in the case of adirect print antenna (DPA) directly printed on the housing, because avertical connection to a radiation pattern is not enabled, an electricconnection can be achieved by using a separate metallic press-in pin.

However, the structure using such a press-in pin will additionallyrequire a process of applying a separate structure, and may causedeterioration of a radiation performance of the antenna when a deviationand an error occur according to the assembly. Further, there are issuesin that material costs increase due to added components, and thepress-in pin cannot be applied to a complicated structure portion, and aperipheral portion may be scratched or deformed in the press-in process.

Further, the FPCB and antenna carrier type of the related art isflexible so that a pattern is movable from a radiation surface of anantenna radiator to a PCB contact surface. An issue may occur insecuring a space that is absolutely necessary for pattern movement.

In addition, a screw structure of the related art may cause an electricshock issue. For example, an inner current may be transferred to anouter metal housing through a screw so than the user may be exposed toelectric shock. In order to prevent this, a capacitor may be disposedaround the screw as an electric safety device. However, this may causethe unit cost to increase, and a separate mounting space may be neededby adopting additional components.

Various embodiments of the present disclosure may provide a housing thatis capable of addressing the above-mentioned problems only by a processof manufacturing the housing using a metal member and a non-metalmember.

Various embodiments may implement conductive and insulative effects at adesired position only by the processes of insert-molding and processinga non-metal member to a metal member.

FIG. 33 is a configuration view illustrating a metal member and anon-metal member which are applied to a housing of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIG. 33, the housing may include a metal member 3310 and anon-metal member 3320 that is insert-molded to the metal member 3310.According to an embodiment of the present disclosure, the metal member3310 may include a metal bezel of the above-described housing. Accordingto an embodiment of the present disclosure, the metal member 3310 mayinclude a metal structure that extends to at least a part of the frontsurface and/or the rear surface of the electronic device from the metalbezel. According to an embodiment of the present disclosure, the metalmember 3310 may include a metal filler 3311 that is independently formedin a space separate from the metal bezel.

According to various embodiments of the present disclosure, thenon-metal member 3320 may include an upper member 3321 and a lowermember 3322. According to an embodiment of the present disclosure, thenon-metal member 3320 may include a plurality of insulation members 3323that are applied to the metal member 3310. According to an embodiment ofthe present disclosure, the insulation members 3323 may contribute tothe insulation between the metal member 3310 and the PCB when fixing thehousing and the bracket or fixing the PCB through screws.

FIGS. 34A and 34B are views illustrating a process of manufacturing ahousing of an electronic device according to various embodiments of thepresent disclosure. FIGS. 35A and 35B are views illustrating aconfiguration of a metal filler according to insert-molding of anon-metal member according to various embodiments of the presentdisclosure.

Referring to FIG. 34A, a primary processing may be performed byextruding a plate-type metal base material, and a non-metal member maybe insert-molded to the primarily processed metal base material.According to an embodiment of the present disclosure, after thenon-metal member is insert-molded to the metal member, a processingprocess may be finally performed.

Referring to FIG. 34B, a primarily processed base material 3420 may beobtained by extruding a plate-type metal base material 3410. Accordingto an embodiment of the present disclosure, the primarily processed basematerial 3420 may include a protruding portion 3423 and a plurality ofrecessed portions 3421 and 3422 that are formed to be relatively lowerthat the protruding portion 3423. According to an embodiment of thepresent disclosure, a non-metal member 3430 may be insert-molded to atleast a part of the plurality of recessed portions 3421 and 3422 and theprotruding portion 3423 of the primarily processed metal base material3420. According to an embodiment of the present disclosure, when aportion indicated by a dotted line in the insert-molded base material isprocessed, the protruding portion 3423 may serve as a metal filler 3423that is disposed independently from the primarily processed basematerial 3420.

FIGS. 35A and 35B are views illustrating a configuration of a metalfiller according to insert-molding of a non-metal member according tovarious embodiments of the present disclosure.

Referring to FIG. 35A, a metal member is illustrated after theinsert-molding and the secondary processing of the non-metal member havebeen completed. Referring to FIG. 35B, a state is illustrated in which anon-metal member 3520 (e.g., a PC) is insert-molded to a metal bezel3510. More particularly, FIG. 35B illustrates a metal bezel 3510 and aunit bezel portion 3511 that is formed by a part of the metal bezel 3510and cut-off portions 3512 to serve as an antenna radiator.

Referring to FIGS. 35A and 35B, the metal bezel 3510 may be disposed tosurround the outer periphery of the electronic device, and one pair ofcut-off portions 3512 may be formed at a certain interval at the lowerside of the metal bezel 3510. According to an embodiment of the presentdisclosure, by insert-molding the non-metal member 3520 to the cut-offportions 3512, the unit bezel portion 3511 may be formed independentlyfrom the metal bezel 3510. According to an embodiment of the presentdisclosure, the unit bezel portion 3511 may serve as an antenna member.According to an embodiment of the present disclosure, a part of the unitbezel portion 3511 may form a contact portion 3514 that is drawn out toextend to the inside of the electronic device. According to anembodiment of the present disclosure, by being formed independently fromthe metal bezel 3510 and the unit bezel portion 3511, the metal filler3513 is operated as a metal island to be used as an electric connectionmember in the vertical direction between a DPA, which is disposed in thehousing, and a PCB that is disposed inside the electronic device.

FIGS. 36A and 36B are views illustrating a state in which a metal filleris used as an electric connection member of an antenna device accordingto various embodiments of the present disclosure.

Referring to FIGS. 36A and 36B, a metal filler 3611 may be disposed tobe isolated by a non-metal member 3620 that is insert-molded to a metalmember 3610 that is used as the metal bezel. According to an embodimentof the present disclosure, the metal member 3610 and the non-metalmember 3620 that is insert-molded to the metal member 3610 may becontributed as a part of the housing 3600 of the electronic device.According to an embodiment of the present disclosure, at least a part ofthe metal filler 3611 may be disposed to be exposed to the outer surfaceof the non-metal member 3620 of the housing 3600. According to anembodiment of the present disclosure, at least a part of the metalfiller 3610 may be disposed to be exposed to the inner surface of thenon-metal member 3620 of the housing 3600.

According to various embodiments of the present disclosure, an antennaradiator 3640 may be disposed on and attached to the outer surface ofthe housing 3600. Without being limited thereto, however, the antennaradiator 3540 may be formed on the outer surface of the housing 3600 byan LDS or DPA method. According to an embodiment of the presentdisclosure, the antenna radiator 3640 may be physically in contact withthe metal filler 3611 exposed to the outer surface of the housing 3600.According to an embodiment of the present disclosure, a PCB 3630 may bedisposed within the electronic device, and an electric connection member3631 may be interposed between the PCB 3630 and the metal filler 3611.According to an embodiment of the present disclosure, as the electricconnection member 3631, various members, such as a C-clip, a thin wirecable, and a flexible printed circuit, may be used.

According to various embodiments of the present disclosure, the antennaradiator (DPA) 3640 attached to the outer surface of the housing 3600 iselectrically connected to the PCB 3630 through the metal filler 3611 andthe electric connection member 3631, so that the antenna radiator 3640may be used as an additional antenna radiator of the electronic deviceor an independent antenna radiator.

FIG. 37 is a configuration view illustrating a principal portion in astate where a non-metal member is insert-molded to a metal memberaccording to various embodiments of the present disclosure.

Referring to FIG. 37, in a housing 3700, the non-metal member 3270 maybe formed on a metal member 3170 by insert-molding. According to anembodiment of the present disclosure, because the metal member 3710 andthe non-metal member 3720 are bonded to each other through bondingbetween dissimilar materials, the metal member 3710 and the non-metalmember 3720 preferably have a separate and additional binding structure.According to an embodiment of the present disclosure, the metal member3710 may include a metal bezel 3714 and a unit bezel 3711 that isseparated from the metal bezel 3714 by cut-off portions 3715. Accordingto an embodiment of the present disclosure, the metal bezel 3714 mayinclude a flange 3712 that is formed to extend inwardly, and at leastone molding opening 3713 may be formed in the flange 3712. Accordingly,when the non-metal member 3720 is insert-molded to the metal member3710, the non-metal member 3720 may be insert-molded to the moldingopening 3713 of the metal member 3710 to serve as a non-metal filler3721, which may support the binding force between the metal member 3710and the non-metal member 3720 which are dissimilar materials.

FIGS. 38A to 38C are configuration views illustrating a state in which anon-metal member is insert-molded to a metal member according to variousembodiments of the present disclosure. FIGS. 38A to 38C illustrate abonding structure for improving the adhesion force between dissimilarmaterials (a metal material and a non-metal material) by the structureof the metal member itself.

Referring to FIG. 38A, a recess 3811 is formed on a metal member 3810,and a non-metal member 3820 may be insert-molded to the recess 3811 tobe formed as a protrusion 3821 so as to support the bonding forcebetween dissimilar materials.

Referring to FIG. 38B, the metal member 3810 and the non-metal member3820 are insert-molded, and a metal filler 3812, which is disposed to bespaced apart from the metal member 3810, causes a plurality ofprotrusions 3813 to protrude along the outer peripheral surface thereofto be molded as non-metal members. Accordingly, it is possible toprevent in advance the metal filler 3812 from being separated or movedin the vertical direction by a pressing force of an electric connectionmember 3831, which is installed on the PCB 3830 and has a certainelasticity.

Referring to FIG. 38C, the metal member 3810 and the non-metal member3820 are insert-molded, and the metal filler 3814, which is disposed tobe spaced apart from the metal member 3810, is also processed byperforming a process, such as sanding or chemical etching, on the outersurface of the metal filler 3814 during the extrusion process. Thus, thesurface frictional force can be increased so that the bonding force ofthe metal filler 3814 with the non-metal 3820 can be increased.Accordingly, it is possible to prevent in advance the metal filler 3821from being separated or moved in the vertical direction by the pressingforce of the electric connection member 3831, which is installed on thePCB 3830 and has certain elasticity.

FIGS. 39A and 39B are configuration views illustrating a state in which,when a non-metal member is insert-molded to a metal member, a part ofthe non-metal member is used as an insulation member according tovarious embodiments of the present disclosure.

Referring to FIGS. 39A and 39B, a housing 3900 may be formed byinsert-molding a non-metal member 3920 to a metal member 3910. Accordingto an embodiment of the present disclosure, on the metal member 3910,one or more insulation members 3921 by the non-metal member 3920 may bedisposed. According to an embodiment of the present disclosure, eachinsulation member 3921 may accommodate a screw 3930, and may beconfigured to prevent in advance an electric shock accident that iscaused by electric power applied to the metal member 3910 through astructure (e.g., a PCB) 3940 within the electronic device.

According to an embodiment of the present disclosure, the insulationmember 3921, which is insert-molded in the metal member 3910, may beformed in a hollow shape to have a depth that is at least the same asthe entire height of the metal member 3910. According to an embodimentof the present disclosure, the screw 3930 inserted into the insulationmember 3921 may be fastened to another structure 3940 of the electronicdevice. According to an embodiment of the present disclosure, the otherstructure 3940 may be a PCB, a bracket, and the like. Accordingly, themetal member 3910 is maintained in the state in which it is completelyinsulated from a structure within the electronic device by theinsulation member 3921, so that an electric shock accident can beprevented in advance.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes a frontglass cover that forms a front surface of the electronic device, a rearcover that forms a rear surface of the electronic device, a bezel thatsurrounds a space formed by the front cover and the rear cover, adisplay device that is embedded in the space and includes a screen areathat is exposed through the front cover, a metal structure that ispositioned within the space and includes a first face that faces thefront cover and a second face that faces the rear cover, a non-metalstructure that is positioned within the space, which partially overlapswith the metal structure, and includes a first surface that faces thefront cover and a second surface that faces the rear cover, and a metalfiller that extends through a part of the non-metal structure from thefirst surface to the second surface of the non-metal structure.

The metal filler is formed of a material that is the same as that of themetal structure, and includes a first end portion adjacent to the firstsurface and a second end portion adjacent to the second surface. Thefirst end portion and/or the second end portion are aligned to form thesame planes with a part of the first surface and/or a part of the secondsurface, respectively.

According to various embodiments of the present disclosure, the firstend portion may be aligned to form the same plane with the firstsurface, and the second end portion may protrude from the secondsurface.

According to various embodiments of the present disclosure, the firstend portion may protrude from the first surface, and the second endportion may be aligned to form the same plane with the second surface.

According to various embodiments of the present disclosure, theelectronic device may further include an antenna pattern adjacent to thefirst surface or the second surface, and the antenna pattern may beelectrically connected with the metal filler.

According to various embodiments of the present disclosure, theelectronic device may further include a communication circuit within thespace, and the communication circuit may be electrically connected tothe antenna pattern through the metal filler.

According to various embodiments of the present disclosure, theelectronic device may further include a flexible conductive structurethat forms an electric connection at the first end portion or the secondend portion.

According to various embodiments of the present disclosure, theelectronic device may further include a PCB within the space, and thePCB may be disposed to be electrically in contact with the flexibleconductive structure.

According to various embodiments of the present disclosure, the PCB maybe positioned between the front cover and the non-metal structure, theflexible conductive structure may be positioned between the PCB and thefirst end portion of the metal filler, and the electronic device mayfurther include an antenna pattern that is positioned between the rearcover and the non-metal structure and is electrically in contact withthe second end portion of the metal filler.

According to various embodiments of the present disclosure, the bezelmay be formed of a metal that is the same as that of the metalstructure, and may be integrally formed with at least a part of themetal structure.

According to various embodiments of the present disclosure, at least apart of the bezel may form a part of an antenna of the electronicdevice.

According to various embodiments of the present disclosure, it ispossible to provide a portable electronic device that includes a frontglass cover that forms a front surface of the electronic device, a rearcover that forms a rear surface of the electronic device, a bezel thatsurrounds a space that is formed by the front cover and the rear cover,a display device that is embedded within the space and includes a screenarea that is exposed through the front cover, a metal structure that ispositioned within the space, and includes a first face that faces thefront cover and a second face that facing the rear cover, a non-metalstructure that is positioned within the space, partially overlaps withthe metal structure, and includes a first surface that faces the frontcover and a second surface that faces the rear cover, and a non-metalfiller that extends from the first face of the metal structure to thesecond face through a part of the metal structure. The non-metal filleris formed of a material that is the same as that of the non-metalstructure, and includes a first end portion adjacent to the first faceof the metal structure and a second end portion adjacent to the secondface of the metal structure. The first end portion and/or the second endportion are aligned with a part of the first face and/or a part of thesecond face so as to form the same planes, respectively.

According to various embodiments of the present disclosure, thenon-metal filler may further include a through-hole and a fastener thatis inserted into the through-hole.

According to various embodiments of the present disclosure, it ispossible to provide a method of manufacturing an electronic device. Themethod includes an operation of manufacturing a structure that includesa bezel that forms at least a part of a side surface to surround a spaceformed by a front cover and a rear cover of the electronic device, and ametal structure and a non-metal structure that are connected with thebezel. The operation of manufacturing the structure includes anoperation of extruding a metal plate, an operation of forming at least apart of the metal structure on the extruded metal plate, in which themetal structure includes at least one protruding portion, an operationof forming at least a part of the non-metal structure by insert-moldingthe metal plate so as to form at least a part of the non-metalstructure, in which the non-metal structure encloses at least a part ofthe protruding portion, and an operation of simultaneously cutting atleast a part of the metal structure and a part of the non-metalstructure and aligning one face of the protruding portion and a part ofthe surface of the non-metal structure to form the same plane.

According to various embodiments of the present disclosure, the methodmay further include an operation of installing the rear cover that formsthe rear surface of the electronic device.

According to various embodiments of the present disclosure, the methodmay further include an operation of installing the front glass coverthat forms the front surface of the electronic device.

According to various embodiments of the present disclosure, because theelectronic device is capable of providing information that may besimultaneously output in various direction through a display that has acurved area, and through this, is capable of intuitionally transferringthe information and improving the convenience of use.

FIG. 40 is a block diagram of a configuration of an electronic deviceaccording to various embodiments of the present disclosure.

Referring to FIG. 40, a configuration of election device 4000 isprovided. The electronic device 4000 may entirely or partiallyconstitute the electronic device 101 of FIG. 1, the device 200 of FIGS.2A to 3. Electronic device 4000 includes at least one AP 4010, acommunication module 4020, a SIM card 4024, a memory 4030, a sensormodule 4040, an input device 4050, a display 4060, an interface 4070, anaudio module 4080, a camera module 4091, a power management module 4095,a battery 4096, an indicator 4097, and a motor 4098.

The AP 4010 controls a plurality of hardware or software elementsconnected to the AP 4010 by driving an operating system or anapplication program. The AP 400 processes a variety of data, includingmultimedia data, and performs arithmetic operations. The AP 4010 may beimplemented, for example, with a system on chip (SoC). The AP 4010 mayfurther include a graphics processing unit (GPU).

The communication module 4020 (e.g., the communication interface 160)performs data transmission/reception in communication between otherelectronic devices (e.g., the second external electronic device 104 orthe server 106) connected with the electronic device 4000 through anetwork. The communication module 4020 includes a cellular module 4021,a Wi-Fi module 4023, a Bluetooth (BT) module 4025, a GPS module 4027, anNFC module 4028, and a radio frequency (RF) module 4029.

The cellular module 4021 provides a voice call, a video call, a textservice, an internet service, and the like, through a communicationnetwork (e.g., LTE, LTE-A, CDMA, WCDMA, UMTS, WiBro, and GSM, and thelike). In addition, the cellular module 4021 identifies andauthenticates the electronic device 4000 within the communicationnetwork by using a SIM card 4024. The cellular module 4021 may performat least some of functions that can be provided by the AP 4010. Forexample, the cellular module 4021 may perform at least some ofmultimedia control functions.

The cellular module 4021 includes a CP. Further, the cellular module4021 may be implemented, for example, with an SoC. Although elements,such as the cellular module 4021 (e.g., the CP), the memory 4030, andthe power management module 4095, are illustrated as separate elementswith respect to the AP 4010 in FIG. 40, the AP 4010 may also beimplemented such that at least one part (e.g., the cellular module 4021)of the aforementioned elements is included in the AP 4010.

The AP 4010 or the cellular module 4021 (e.g., the CP) loads aninstruction or data, which is received from each non-volatile memoryconnected thereto or at least one of different elements, to a volatilememory and processes the instruction or data. In addition, the AP 4010or the cellular module 4021 stores data, which is received from at leastone of different elements or generated by at least one of differentelements, into the non-volatile memory.

Each of the Wi-Fi module 4023, the BT module 4025, the GPS module 4027,and the NFC module 4028 includes a processor for processing datatransmitted/received through a corresponding module. Although thecellular module 4021, the Wi-Fi module 4023, the BT module 4025, the GPSmodule 4027, and the NFC module 4028 are illustrated in FIG. 40 asseparate blocks, according to an embodiment of the present disclosure,at least some (e.g., two or more) of the cellular module 4021, the Wi-Fimodule 4023, the BT module 4025, the GPS module 4027, and the NFC module4028 may be included in one integrated chip (IC) or IC package. Forexample, at least some of processors corresponding to the cellularmodule 4021, the Wi-Fi module 4023, the BT module 4025, the GPS module4027, and the NFC module 4028 (e.g., a communication processorcorresponding to the cellular module 4021 and a Wi-Fi processorcorresponding to the Wi-Fi module 4023) may be implemented with an SoC.

The RF module 4029 transmits/receives data, for example an RF signal.The RF module 4029 may include, for example, a transceiver, a power ampmodule (PAM), a frequency filter, a low noise amplifier (LNA), and thelike. In addition, the RF module 4029 may further include a componentfor transmitting/receiving a radio wave on a free space in wirelesscommunication, for example, a conductor, a conducting wire, and thelike. Although it is illustrated in FIG. 40 that the cellular module4021, the WiFi module 4023, the BT module 4025, the GPS module 4027, andthe NFC module 4028 share one RF module 4029, according to an embodimentof the present disclosure, at least one of the cellular module 4021, theWi-Fi module 4023, the BT module 4025, the GPS module 4027, the NFCmodule 4028 may transmit/receive an RF signal via a separate RF module.

The SIM card 4024 is a card which is inserted into a slot formed at aspecific location of the electronic device 4000. The SIM card 4024includes unique identification information (e.g., an integrated circuitcard identifier (ICCID)) or subscriber information (e.g., aninternational mobile subscriber identity (IMSI)).

The memory 4030 (e.g., the memory 400) includes an internal memory 4032or an external memory 4034.

The internal memory 4032 may include, for example, at least one of avolatile memory (e.g., a dynamic random access memory (DRAM), a staticRANI (SRAM), a synchronous DRAM (SDRAM), and the like) or a non-volatilememory (e.g., a one-time programmable read-only memory (OTPROM), a PROM,an erasable and programmable ROM (EPROM), an electrically erasable andprogrammable ROM (EEPROM), a mask ROM, a flash ROM, a NAND flash memory,a NOR flash memory, and the like). The internal memory 4032 may be asolid state drive (SSD).

The external memory 4034 may include a flash drive, and may furtherinclude, for example, compact flash (CF), secure digital (SD), micro-SD,mini-SD, extreme Digital (xD), memory stick, and the like. The externalmemory 4034 may be operatively coupled to the electronic device 4000 viavarious interfaces.

The electronic device 4000 may further include a storage unit (or astorage medium), such as a hard drive.

The sensor module 4040 measures a physical quantity or detects anoperation state of the electronic device 4000, and converts the measuredor detected information into an electric signal. The sensor module 4040includes, for example, at least one of a gesture sensor 4040A, a gyrosensor 4040B, a barometric pressure sensor 4040C, a magnetic sensor4040D, an acceleration sensor 4040E, a grip sensor 4040F, a proximitysensor 4040G a color sensor 4040H (e.g., a red, green, blue (RGB)sensor), a bio sensor 4040I, a temperature/humidity sensor 4040J, anillumination sensor 4040K, and a UV sensor 4040M. Additionally oralternatively, the sensor module 4040 may include, for example, anE-node sensor, an electromyography (EMG) sensor, an electroencephalogram(EEG) sensor, an electrocardiogram (ECG) sensor, a fingerprint sensor,and the like. The sensor module 4040 may further include a controlcircuit for controlling at least one or more sensors included therein.

The input device 4050 includes a touch panel 4052, a (digital) pensensor 4054, a key 4056, or an ultrasonic input unit 4058.

The touch panel 4052 recognizes a touch input, for example, by using atleast one of an electrostatic type, a pressure-sensitive type, and anultrasonic type. The touch panel 4052 may further include a controlcircuit. In case of the electrostatic type of touch panel 4052, not onlyis physical contact recognition possible, but proximity recognition isalso possible. The touch penal 4052 may further include a tactile layer.In this case, the touch panel 4052 provides the user with a tactilereaction.

The (digital) pen sensor 4054 may be implemented, for example, by usingthe same or similar method of receiving a touch input of the user or byusing an additional sheet for recognition.

The key 4056 may be, for example, a physical button, an optical key, akeypad, or a touch key.

The ultrasonic input unit 4058 is a device by which the electronicdevice 4000 detects a sound wave through a microphone 4088 by using apen which generates an ultrasonic signal, and is capable of radiorecognition.

The electronic device 4000 may use the communication module 4020 toreceive a user input from an external device (e.g., a computer or aserver) connected thereto.

The display 4060 (e.g., the display 150) includes a panel 4062, ahologram 4064, or a projector 4066.

The panel 4062 may be, for example, an LCD, an AM-OLED, and the like.The panel 4062 may be implemented, for example, in a flexible,transparent, or wearable manner. The panel 4062 may be constructed asone module with the touch panel 4052.

The hologram 4064 uses an interference of light and displays astereoscopic image in the air.

The projector 4066 displays an image by projecting a light beam onto ascreen. The screen may be located inside or outside the electronicdevice 4000.

The display 4060 may further include a control circuit for controllingthe panel 4062, the hologram 4064, or the projector 4066.

The interface 4070 includes, for example, an HDMI 4072, a USB 4074, anoptical communication interface 4076, or a D-subminiature (D-sub) 4078.The interface 4070 may be included, for example, in the communicationinterface 160 of FIG. 1. Additionally or alternatively, the interface4070 may include, for example, Mobile high-definition link (MHL) (notshown), SD/multi-media card (MMC) or infrared data association (IrDA).

The audio module 4080 bilaterally converts a sound and electric signal.At least some elements of the audio module 40040 may be included in theinput/output interface 140 of FIG. 1. The audio module 4080 convertssound information which is input or output through a speaker 4082, areceiver 4084, an earphone 4086, the microphone 4088, and the like.

The camera module 4091 is a device for image and video capturing, andmay include one or more image sensors (e.g., a front sensor or a rearsensor), a lens, an image signal processor (ISP) (not shown), or a flash(not shown, e.g., an LED or a xenon lamp).

The power management module 4095 manages power of the electronic device4000. The power management module 4095 may include a power management IC(PMIC), a charger IC, or a battery gauge.

The PMIC may be placed inside an IC or SoC semiconductor. Charging isclassified into wired charging and wireless charging. The charger ICcharges a battery, and prevents an over-voltage or over-current flowfrom a charger. The charger IC includes a charger IC for at least one ofthe wired charging and the wireless charging.

The wireless charging may be classified, for example, into a magneticresonance type, a magnetic induction type, and an electromagnetic type.An additional circuit for the wireless charging, for example, a coilloop, a resonant circuit, a rectifier, and the like, may be added.

The battery gauge measures, for example, a residual quantity of thebattery 4096 and a voltage, current, and temperature during charging.The battery 4096 stores or generates electricity and supplies power tothe electronic device 4000 by using the stored or generated electricity.The battery 4096 may include a rechargeable battery or a solar battery.

The indicator 4097 indicates a specific state, for example, a bootingstate, a message state, a charging state, and the like, of theelectronic device 4000 or a part thereof (e.g., the AP 4010).

The motor 4098 converts an electric signal into a mechanical vibration.

The electronic device 4000 includes a processing unit (e.g., a GPU) forsupporting mobile TV. The processing unit for supporting mobile TVprocesses media data according to a protocol of, for example, digitalmultimedia broadcasting (DMB), digital video broadcasting (DVB), mediaflow, and the like.

Each of the aforementioned elements of the electronic device accordingto various embodiments of the present disclosure may consist of one ormore components, and names thereof may vary depending on a type ofelectronic device. The electronic device according to variousembodiments of the present disclosure may include at least one of theaforementioned elements. Some of the elements may be omitted, oradditional other elements may be further included. In addition, some ofthe elements of the electronic device may be combined and constructed asone entity, so as to equally perform functions of corresponding elementsbefore combination.

The term “module” used herein may imply a unit including one ofhardware, software, and firmware, or a combination of them. The term“module” may be interchangeably used with terms, such as unit, logic,logical block, component, circuit, and the like. The “module” may be aminimum unit of an integrally constituted component or may be a partthereof. The “module” may be a minimum unit for performing one or morefunctions or may be a part thereof. The “module” may be mechanically orelectrically implemented. For example, the “module” of the presentdisclosure includes at least one of an application-specific IC (ASIC)chip, a field-programmable gate arrays (FPGAs), and a programmable-logicdevice, which are known or will be developed and which perform certainoperations.

According to various embodiments of the present disclosure, at leastsome parts of a device (e.g., modules or functions thereof) or method(e.g., operations) may be implemented with an instruction stored in acomputer-readable storage media for example. The instruction may beexecuted by one or more processors (e.g., the processor 4010), toperform a function corresponding to the instruction. Thecomputer-readable storage media may be, for example, the memory 4030. Atleast some parts of the programming module may be implemented (e.g.,executed), for example, by the processor 4010. At least some parts ofthe programming module may include modules, programs, routines, sets ofinstructions, processes, and the like, for performing one or morefunctions.

Certain aspects of the present disclosure can also be embodied ascomputer readable code on a non-transitory computer readable recordingmedium. A non-transitory computer readable recording medium is any datastorage device that can store data which can be thereafter read by acomputer system. Examples of the non-transitory computer readablerecording medium include a Read-Only Memory (ROM), a Random-AccessMemory (RAM), Compact Disc-ROMs (CD-ROMs), magnetic tapes, floppy disks,and optical data storage devices. The non-transitory computer readablerecording medium can also be distributed over network coupled computersystems so that the computer readable code is stored and executed in adistributed fashion. In addition, functional programs, code, and codesegments for accomplishing the present disclosure can be easilyconstrued by programmers skilled in the art to which the presentdisclosure pertains.

At this point it should be noted that the various embodiments of thepresent disclosure as described above typically involve the processingof input data and the generation of output data to some extent. Thisinput data processing and output data generation may be implemented inhardware or software in combination with hardware. For example, specificelectronic components may be employed in a mobile device or similar orrelated circuitry for implementing the functions associated with thevarious embodiments of the present disclosure as described above.Alternatively, one or more processors operating in accordance withstored instructions may implement the functions associated with thevarious embodiments of the present disclosure as described above. Ifsuch is the case, it is within the scope of the present disclosure thatsuch instructions may be stored on one or more non-transitory processorreadable mediums. Examples of the processor readable mediums include aROM, a RAM, CD-ROMs, magnetic tapes, floppy disks, and optical datastorage devices. The processor readable mediums can also be distributedover network coupled computer systems so that the instructions arestored and executed in a distributed fashion. In addition, functionalcomputer programs, instructions, and instruction segments foraccomplishing the present disclosure can be easily construed byprogrammers skilled in the art to which the present disclosure pertains.

The module or programming module according to various embodiments of thepresent disclosure may further include at least one or more elementsamong the aforementioned elements, may omit some of them, or may furtherinclude additional elements. Operations performed by a module,programming module, or other elements may be executed in a sequential,parallel, repetitive, or heuristic manner. In addition, some of theoperations may be executed in a different order or may be omitted, orother operations may be added.

While the present disclosure has been shown and described with referenceto various embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present disclosure asdefined by the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a transparentfront glass cover that comprises a planar surface that forms a frontsurface of the electronic device; a planar rear glass cover that forms arear surface of the electronic device; a metal bezel that surrounds aspace formed by the front glass cover and the rear glass cover; and aflexible display device that is embedded in the space and exposedthrough the front glass cover, wherein the front glass cover comprises:a first curved surface that extends from a first side edge of the planarsurface, and a second curved surface that extends from a second sideedge of the planar surface and is formed opposite to the first curvedsurface, wherein the flexible display device comprises a touch screenthat extends along the first curved surface, the planar surface, and thesecond curved surface, wherein the metal bezel comprises: a first sidesurface that encloses an edge of the first curved surface, a second sidesurface that encloses an edge of the second curved surface, a third sidesurface that interconnects one end of the first side surface and one endof the second side surface, and a fourth side surface that interconnectsthe other end of the first side surface and the other end of the secondside surface, and wherein the first side surface and the second sidesurface have a first height and the third side surface and the fourthside surface have a second height that is larger than the first height.2. The electronic device of claim 1, wherein, in a corner where thefirst side surface and the third side surface are interconnected and ina corner where the first side surface and the fourth side surface areinterconnected, the height of the first side surface gradually increasesfrom the first height to the second height.
 3. The electronic device ofclaim 1, wherein, in a corner where the second side surface and thethird side surface are interconnected and in a corner where the secondside surface and the fourth side surface are interconnected, the heightof the second side surface gradually increases from the first height tothe second height.
 4. The electronic device of claim 1, furthercomprising: a communication receiver speaker that penetrates an openingformed through the front glass cover.
 5. The electronic device of claim1, further comprising: a processor and a memory within the space,wherein the memory is configured to store instructions that, upon beingexecuted, cause the processor to display: a first screen on a first areaof the touch screen, which is positioned on the planar surface; a secondscreen that is differentiated from the first screen, on a second area ofthe touch screen, which is positioned on the first curved surface; and athird screen that is differentiated from the first screen, on a thirdarea of the touch screen, which is positioned on the second curvedsurface.
 6. The electronic device of claim 1, wherein the flexibledisplay device comprises a single flexible organic light emitting diode(OLED) display that extends along the first curved surface, the planarsurface, and the second curved surface.
 7. The electronic device ofclaim 1, further comprising: a first non-metal portion and a secondnon-metal portion that are formed on the third side surfaceperpendicular to a longitudinal direction of the third side surface. 8.The electronic device of claim 7, further comprising: at least one of anopening on the third side surface between the first non-metal portionand the second non-metal portion, a subscriber identification module(SIM) tray that is removably inserted into the opening, and an infrared(IR) device that is exposed on the third side surface.
 9. The electronicdevice of claim 8, wherein the first non-metal portion is positionedclose to the first side surface and the second non-metal surface ispositioned close to the second side surface, and wherein the IR deviceis positioned in a middle portion of the third side surface between thefirst non-metal portion and the second non-metal portion.
 10. Theelectronic device of claim 9, further comprising: an opening that isformed on the third side surface between the first non-metal portion orthe second non-metal portion and the IR device, the SIM tray beingremovably inserted into the opening.
 11. The electronic device of claim7, further comprising: a third non-metal portion and a fourth non-metalportion that are formed on the fourth side surface perpendicular to alongitudinal direction of the fourth side surface.
 12. The electronicdevice of claim 11, further comprising: at least one of an audio deviceinsertion hole, a connector opening, and a speaker hole on the fourthside surface between the third non-metal portion and the fourthnon-metal portion.
 13. The electronic device of claim 12, wherein thethird non-metal portion is positioned close to the first side surfaceand the fourth non-metal portion is positioned close to the second sidesurface, and wherein the connector opening is positioned in a middleportion of the third side surface between the third non-metal portionand the fourth non-metal portion.
 14. The electronic device of claim 13,wherein the audio device insertion hole is positioned between the thirdnon-metal portion and the connector opening, and wherein the speakerhole is positioned between the fourth non-metal portion and theconnector opening.
 15. The electronic device of claim 1, furthercomprising: at least one of a near field communication (NFC) antenna, awireless charge coil, and a magnetic emulator antenna within the spaceclose to the rear glass cover.
 16. The electronic device of claim 1,further comprising: at least one opening and at least one sound controlkey on the first side surface or the second side surface, the soundcontrol key being configured to be pushed through the opening.
 17. Theelectronic device of claim 16, further comprising: at least one openingand a power key on the second surface or the first surface, which isopposite to the first side surface or the second side surface, whichcomprises the sound control key, the power key being configured to bepushed through the opening.
 18. The electronic device of claim 1,further comprising: a first touch area on a part of the first curvedsurface and/or a second touch area on a part of the second curvedsurface, wherein the electronic device is configured to receive a volumecontrol input through at least one of the first touch area and thesecond touch area.
 19. The electronic device of claim 18, wherein thevolume control input comprises a gesture input on a part of the firsttouch area or the second touch area.
 20. The electronic device of claim19, further comprising: a first touch area on a part of the first curvedsurface and/or a second touch area on a part of the second curvedsurface, wherein the electronic device is configured to receive a powerON or OFF input through at least one of the first touch area and thesecond touch area.
 21. An electronic device comprising: a transparentfront glass cover that comprises a first planar surface that forms afront surface of the electronic device; a planar rear glass cover thatcomprises a second planar surface that forms a rear surface of theelectronic device; a metal bezel that surrounds a space formed by thefront glass cover and the rear glass cover; and a flexible displaydevice that is embedded in the space and exposed through the front glasscover, wherein the front glass cover comprises: a first curved surfacethat extends from a first side edge of the first planar surface, and asecond curved surface that extends from a second side edge of the firstplanar surface and is formed opposite to the first curved surface,wherein the rear glass cover comprises: a third curved surface thatextends from a first side edge of the second planar surface, and afourth curved surface that extends from a second side edge of the secondplanar surface and is formed opposite to the third curved surface,wherein the flexible display device comprises a touch screen thatextends along the first curved surface, the first planar surface, andthe second curved surface, wherein the metal bezel comprises: a firstside surface that encloses edges of the first curved surface and thethird curved surface, a second side surface that encloses edges of thesecond curved surface and the fourth curved surface, a third sidesurface that interconnects one end of the first side surface and one endof the second side surface, and a fourth side surface that interconnectsthe other end of the first side surface and the other end of the secondside surface, and wherein the first side surface and the second sidesurface have a first height and the third side surface and the fourthside surface have a second height that is larger than the first height.